SOLID-STATE DIFFUSION BONDING OF INCONEL ALLOY 718 TO 17-4 PH STAINLESS STEEL

Abstract

Solid-state diffusion bonding of Inconel® alloy 718 to 17-4 PH® stainless steel was studied. Mechanical tests and metallographic examinations were used to evaluate the joint quality. The effect of bonding pressure on the joint integrity was assessed. In all joints, failure occurred nearly without plastic deformation. The thermal residual stress generated from cooling to room temperature was calculated by finite element modeling. The result showed that the poor joint ductility was not caused by the residual stress, but by the formation of continuous intermetallic films along the interface.

Keywords:

• Bonding pressure
• Diffusion bonding
• Finite element modeling
• Inconel alloy 718
• Intermetallic film
• Joining
• Joint quality
• Mechanical property
• Mechanical test
• Metallographic examination
• Microstructure
• Processing parameter
• Residual stress
• Stainless steel
• Solid state

Acknowledgments