Simulation of resin flow during compression of copper-clad thermoset composite laminates

Abstract

This research included the modeling and simulation of the flow of epoxy resin during manufacturing of copper-clad laminates. Three conceptual models were proposed, based on the three resin flow mechanisms during processing: squeezing flow in thin fluid channels, seepage though a permeable medium, and a combination of squeezing and seepage flow. The similarity between the governing equations of each of the models was illustrated using dimensional analysis. The viscosity effect caused by the resin curing process was taken into consideration in the flow models. The results from the simulations provided deep insight into the dependence of the models on the respective geometric and empirical parameters.

Acknowledgments

The authors would like to acknowledge AlliedSignal Laminate Systems, Inc. and the State of Wisconsin, Office of University-Industry Research for their support and permission to publish this paper.