![Sample our Physical Sciences journals, sign in here to start your FREE access for 14 days]({"type":"image" , "src" : "/sda/110819/TOC-Subject-Sample-2021-Physical-Sciences.jpg"})
Abstract
In order to reduce the maximum peel and shear stress concentrations in the adhesive layer, a smart adhesively bonded scarf joint system was developed by surface bonding of piezoelectric patches onto a typical scarf joint. The forces and bending moments at the edges of the developed smart joint system can be adaptively controlled by adjusting the applied electric field on the piezoelectric patches, thus reducing the peel and shear stresses concentration in the adhesive layer. In order to verify the effect of surface bonding of piezoelectric patches in smart scarf adhesive joints, an analytical model was developed to evaluate the shear stress distribution and to predict the peel stress. It was established that the piezoelectric patched joint could reduce the stress concentrations at the scarf joint edges. The influence of the electric field and the effects of the scarf angle and the adherend Young's modulus on the peel and shear stresses were investigated. It was found that the effect of scarf angle is more significant at higher angles to raise the stresses. The effect of the electric field on the shear stress is more significant than on the peel stress.