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Abstract
In this paper, the influences of pulse plating parameters and additives upon the uniformity of through-hole copper plating were investigated by orthogonal experimental design methods. Firstly, the L9 (34) level experiments were employed to study the effects of PEG-8000, SPS, Cl– and JGB, on the uniformity of through-hole copper plating. It was found that SPS was the key factor for the uniformity, and PEG followed; 86·7% uniformity was obtained with appropriate additive concentrations. In addition, the interactions between the major influential factors, namely SPS and PEG-8000 were studied under fixed Cl– and JGB concentration, and 88·7% uniformity was observed. The L25 (56) experiments were employed to study the impacts of pulse parameters on the uniformity of through-hole copper plating under the confirmed additives concentration. The results indicated that the forward pulse current (J avg.c) made the greatest contribution in the uniformity of through-hole copper plating, followed by the forward pulse duty cycle (γ c). Finally, the uniformity was nearly 100% when the interactions between J avg.c and γ c were studied under the relative proper levels of other factors.