Abstract
Ultrasonic cleaning with organic solvent, heat treatment in nitrogen atmosphere and their combined process are performed to purify the SiC particles. SiCp/Al composites containing vol. 55–57% SiCp purified by the combined process are fabricated by pressureless infiltration. The results showed that the SiCp/Al composites fabricated with SiCp purified by the combined process possess smooth and clean interface without interface reaction products. The prepared composites exhibit an excellent thermal conductivity (252 W m−1 K−1), a high elastic modulus (238.01 ± 5.6 GPa) as well as a high tensile strength (432.32 ± 18.82 MPa). The proposed combined process demonstrates a better purification effect than the other two methods.