Nanoadhesive materials on micro cutters in micro/nanomilling of single crystal silicon

Abstract

Nanomaterials adhesive to cutters in micro/nanomilling of single crystal silicon affect brittle-to-ductile transitions, because the nanomaterials adhesive to micro tools change the cutting conditions greatly. The nanomaterials are unknown and need to be studied to assure the stable micro/nanomilling of single crystal silicon for various very important engineering applications. Based on the results measured by energy dispersive X-ray spectroscopy, the dominant nanoadhesive materials are studied and identified. It turns out that the chemical reactions occurred during high-speed frictions between the cutter and the silicon. The countermeasures are proposed to remove the nanoadhesive material in process to assure the possibilities for long-time continuous ductile-regime micro/nanomilling of single crystal silicon. Experimental evaluations show the feasibility of the study.

Keywords:

• Nanoporous material
• Adhesive phenomenon
• Micro/nanomilling
• Silicon