Thermal ratcheting of solder bonded layered plates: experiments and analysis

Abstract

This paper describes experiments and analysis of the warpage of Si/solder/Cu layered plates subjected to cyclic thermal loading. As received and annealed Cu plates are used as the Cu layer, and three thickness ratios are considered for the Si and Cu layers. It is experimentally shown that the initial warpage caused by soldering either grows or recovers with an increase in the number of temperature cycles and that the cyclic growth of warpage is apparent when the Cu layer is annealed and is relatively thick. Then, by performing a three‐dimensional finite element analysis, it is demonstrated that the cyclic growth and recovery of warpage shown experimentally can be simulated well if an appropriate constitutive model is employed for kinematic hardening in the Cu layer.

Keywords:

• Thermal ratcheting
• Layered plates
• Constitutive behaviour
• Experiments
• Finite element analysis