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Materials Research Innovations Volume 16, 2012 - Issue 1
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Original Article

Study on Al/Mg compound materials by solid–liquid bonding method

X Y Song School of Materials Science and EngineeringDalian University of Technology, Dalian116085, ChinaCorrespondence[email protected]
,
J B Sun School of Materials Science and EngineeringDalian University of Technology, Dalian116085, China; School of Materials Science and EngineeringJiamusi University, Jiamusi154007, China
,
D S Zhong School of Materials Science and EngineeringDalian University of Technology, Dalian116085, China
,
Y S Yu School of Materials Science and EngineeringDalian University of Technology, Dalian116085, China
,
T M Wang School of Materials Science and EngineeringDalian University of Technology, Dalian116085, China
,
Z Q Cao School of Materials Science and EngineeringDalian University of Technology, Dalian116085, China
&
T J Li School of Materials Science and EngineeringDalian University of Technology, Dalian116085, China
 show all
Pages 51-55 | Received 12 Jun 2011, Accepted 15 Aug 2011, Published online: 12 Nov 2013
 
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Abstract

Al/Mg compound materials were fabricated by a solid–liquid bonding method. The well bonded interface with a transition layer can be obtained. There were two kinds of interface structures in the ingot. The microstructures and bonding properties of Al/Mg interface were studied. The results showed that the brittle interface layer was composed mainly of intermetallic compound Al12Mg17 and Al3Mg2 at the top part and Al3Mg2 at the bottom part of ingot respectively. The reason why two kinds of interface structures existed was explained.

The authors wish to express their appreciation to the support of the National Natural Science Foundation of China (grant no. 51074031) and Korea Nation Project ‘Study on the Mechanism of Mg/Al Alloys Duo Casting Technology’.

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