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Original Articles

Preparation of Ti–Ni binary powder via electroless nickel plating of titanium powder

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Pages 97-102 | Received 02 May 2013, Accepted 31 Aug 2013, Published online: 06 Dec 2013
 

Abstract

In this study, Ti powder (average size: 45 μm) was plated/coated by electroless Ni with hydrazine hydrate as reductant. The Ni plating was carried out at 85°C and pH 9–10. The influence of process parameters such as plating period as well as reductant concentration was investigated. The Ni plated Ti powder was characterised by scanning electron microscopy, energy dispersive spectrometer analysis and X-ray fluorescence. It is found that a pure/uniform Ni layer may be deposited on the Ti powder particles. The deposited mass increases as plating period/reductant concentration increases.

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