Electrodeposition of copper on aligned multi-walled carbon nanotubes

Abstract

In this work, the electrochemical deposition of copper on aligned multi-walled carbon nanotubes (MWCNTs) from an aqueous electrolyte is described. The addition of sodium dodecyl sulphate has been applied to enhance wettability of the hydrophobic MWCNT surface. The transfer of the MWCNT–copper composite film from nickel substrates, as applied for the chemical vapour deposition process for carbon nanotube synthesis, onto adhesive tapes is performed. Moreover, a sandwich layer consisting of copper top layers and copper incorporated MWCNT interlayer was produced. The structure of the resulting composite material of MWCNTs and copper was characterised by scanning electron microscopy. An electrochemical investigation of the MWCNTs on nickel foil and on conductive carbon ribbon by cyclic voltammetry is presented.

Keywords:

• Electrodeposition
• Plating
• Copper
• Carbon nanotubes
• Aligned MWCNT
• Cyclic voltammetry

The authors wish to thank the European Union and the Free State of Saxony for the financial funds of this project (grant no. 13858/2379).