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Transactions of the IMF
The International Journal of Surface Engineering and Coatings
Volume 89, 2011 - Issue 2
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Conference Report

Conductivity of acid zinc and copper plating solutions

D R Gabe Department of MaterialsLoughborough University, Loughborough LE11 3TU, UKCorrespondence[email protected]
,
M Li Department of MaterialsLoughborough University, Loughborough LE11 3TU, UK
&
Z Ding Department of MaterialsLoughborough University, Loughborough LE11 3TU, UK
Pages 76-79 | Published online: 12 Nov 2013
 
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Abstract

Conductivity data are presented for the common acid solutions (sulphate, chloride) used in the electrodeposition of zinc and copper. Optimised solution concentrations may be defined and the values obtained indicate the dominant ions which are present in solution at specific concentrations and temperatures.

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