![Sample our Engineering & Technology journals, sign in here to start your access, latest two full volumes FREE to you for 14 days]({"type":"image" , "src" : "/sda/5933/TOC-Subject-Sample-2021-Engineering-Tech.jpg"})
Abstract
Background:
Factors that influence exposure to silver particles from the use of textiles are not well understood.
Objectives:
The aim of this study was to evaluate the influence of product treatment and physiological factors on silver release from two textiles.
Methods:
Atomic and absorbance spectroscopy, electron microscopy, and dynamic light scattering (DLS) were applied to characterize the chemical and physical properties of the textiles and evaluate silver release in artificial sweat and saliva under varying physiological conditions. One textile had silver incorporated into fiber threads (masterbatch process) and the other had silver nanoparticles coated on fiber surfaces (finishing process).
Results:
Several complementary and confirmatory analytical techniques (spectroscopy, microscopy, etc.) were required to properly assess silver release. Silver released into artificial sweat or saliva was primarily in ionic form. In a simulated “use” and laundering experiment, the total cumulative amount of silver ion released was greater for the finishing process textile (0·51±0·04%) than the masterbatch process textile (0·21±0·01%); P<0·01.
Conclusions:
We found that the process (masterbatch vs finishing) used to treat textile fibers was a more influential exposure factor than physiological properties of artificial sweat or saliva.
Acknowledgements
This work was funded by the U.S. Consumer Product Safety Commission (CPSC) under Inter-Agency Agreement CPSC-I-10-006. Mention of a specific product or company does not constitute endorsement by the Centers for Disease Control and Prevention. The findings and conclusions in this report are those of the authors and do not necessarily represent the views of NIOSH or CPSC. The authors wish to thank Dr. F. Selcen Kilinc-Balci at NIOSH and Drs. D. Holbrook and R. I. MacCuspie at NIST for critical review of this manuscript.