Polycrystalline oxides formation during transient oxidation of (001) Cu–Ni binary alloys studied by in situ TEM and XRD

Abstract

The nucleation and growth of Cu₂O and NiO islands due to oxidation of Cu_xNi_1–x(001) films were monitored, at various temperatures, by in situ ultra-high vacuum (UHV) transmission electron microscopy (TEM) and in situ synchrotron X-ray diffraction (XRD). In remarkable contrast to our previous observations of Cu and Cu–Au oxidation, irregular-shaped polycrystalline oxide islands formed with respect to the Cu – Ni alloy film, and an unusual second oxide nucleation stage was noted. In situ XRD experiments revealed that NiO formed first epitaxially, then other orientations appeared, and finally polycrystalline Cu₂O developed as the oxidation pressure was increased. The segregation of Ni and Cu towards or away, respectively, from the alloy surface during oxidation could disrupt the surface and cause polycrystalline oxide formation.

Keywords:

• oxidation
• copper
• nickel
• thin film
• Cu₂O
• NiO
• in situ ultra-high vacuum transmission electron microscope
• in situ synchrotron X-ray diffraction