Publication Cover
Transactions of the IMF
The International Journal of Surface Engineering and Coatings
Volume 62, 1984 - Issue 1
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Original Articles

A better understanding of the through-hole plating of printed circuit boards: Pt II—multilayer boards

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Pages 13-16 | Received 10 May 1983, Published online: 08 May 2017

REFERENCES

  • J. R. House, B. C. Jackson and S. K. Nagi, Trans IMF, 1983, 60, 131; IPC tech pub, 1982, 437.
  • G. Leonida, ‘Handbook of Printed Circuit Design, Manufacture and Assembly,’ Electrochemical Publications, Ayr.
  • P. E. Kukanskis, IPC tech pub, 1982, 435.
  • L. S. Perrone, Proc 2nd PC World Convention, 1981, 127.
  • A. Worrell, Proc INTERNEPCON, Brighton, 1982.
  • A. Parker, IPC, San Diego, 1982.

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