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Transactions of the IMF

The International Journal of Surface Engineering and Coatings

Volume 62, 1984 - Issue 1

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Original Articles

New development in high speed copper plating for printed wiring board applications

S. BarbieriSel-Rex Plating Systems, OMI International Corporation, Nutley, New Jersey

Linda MayerSel-Rex Plating Systems, OMI International Corporation, Nutley, New Jersey

Jieh-Hwa ShyuSel-Rex Plating Systems, OMI International Corporation, Nutley, New Jersey

Pages 25-28 | Received 20 Jan 1984, Published online: 08 May 2017

Cite this article
https://doi.org/10.1080/00202967.1984.11870664

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REFERENCES

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