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Publication Cover
Transactions of the IMF
The International Journal of Surface Engineering and Coatings
Volume 68, 1990 - Issue 2
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Original Articles

Electroplating High Aspect Ratio Through Holes in Thick Printed Circuit Boards

G. L. FisherShipley Company, Newton, MA
,
W. SonnenbergShipley Company, Newton, MA
,
J. BladonShipley Company, Newton, MA
&
R. BernardsShipley Company, Newton, MA
Pages 50-54 | Published online: 08 May 2017

REFERENCES

  • E. K. Yung, L. T. Romankiw and R. C. Alkire, Proc. Electrodeposition Technol. Symp., 75-101, The Electrochemical Society, 1987.
  • G. Fisher and P. J. Pellegrino, Plating Surf. Finish. 1988, 75, (6), 88.
  • J. Reid, Printed Circuit Fabrication 1987, 10, (11), 65.

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