REFERENCES
- J.W. Dini and H.R. Johnson, Electrochemical Joining Process, Application and Property Data, SME Technical Paper, 1975 ADE 75.
- T. Romankiw, Electrodeposition Technology, Theory and Practice, Proceedings of the Electrochemical Society, USA 1987, 639.
- J.W. Dini, Weld. J., 1982, 33.
- R.A. Morely and J. Caruso, Weld. J., 1980, 29.
- J.W. Dini, H.R. Johnson and J.R. Helms, High Strength Nickel-Cobalt deposits for Electro Joining Applications, Sandia Laboratories, Livermore, 1973, 56.
- G Sheela, M. Ramasami, Chepuri R.K. Rao and Malathy Pushpavanam, Trans. Inst. Met. Fin. 2002, 80 (2), 49.
- G. Sheela, M. Ramasami, Chepuri R.K. Rao and M. Pushpavanam, Bull, of Electrochem. 2001, 17 (8), 347.
- G Sheela, V.S. Muralidharan and M. Pushpavanam, submitted to Br. Corr. J.
- G. Sheela, V.S. Muralidharan and M. Pushpavanam, Submitted to Corr. Sc.
- E. Raub and K. Muller, “Fundamentals of Metal deposition-Principles & Practice” Elsevier Publishing Company, Amsterdam-London-New York, 1967, 211.
- Metal finishing Guidebook and Directory, 2003, 101, 1A 350.
- K. L. Mittal, “Adhesion Measurement of thin Films, Thick films and Bulk Coatings.” American Society for Testing and Materials, Philadelphia, 1976, 305.
- A. Bodnevas and J. Zahavi, Plat. Surf. Fin., 1993, 91, 53.
- S.A. Watson (Ed.), Electroforming and Electroless Plating with Nickel, November 1990, Bangalore, India. Technical Paper-6.