Publication Cover
Transactions of the IMF
The International Journal of Surface Engineering and Coatings
Volume 100, 2022 - Issue 5
267
Views
2
CrossRef citations to date
0
Altmetric
Articles

Electrochemical double-pulse technique to modulate the roughened surface of copper foil for copper-clad laminates

, , & ORCID Icon
Pages 276-282 | Received 01 Nov 2021, Accepted 26 Mar 2022, Published online: 14 Apr 2022

References

  • S. H. Lee, K. S. Kim, J. H. Shim and C.-H. Ahn: High-performance printed circuit board materials based on benzoxazine and epoxy blend system. Macromol. Res, 2018, 26, 388–393.
  • J. LaDou: Printed circuit board industry. Int. J. Hyg. Environ. Health, 2006, 209(3), 211–219.
  • V. A. Callcut: Coppers for electrical purposes. IEE. Proc. A, 1986, 133(4), 174–201.
  • J.-C. Cho, H.-Y. Lee, S.-T. Lim, M.-S. Park, Y.-S. Oh, M.-S. Cho and Y.-K. Lee: Composition-dependent curing behavior and peel strength of epoxy resins for printed circuit boards (PCBs). Macromol. Res., 2010, 18, 47–52.
  • H. Shi, X. Liu and Y. Lou: Materials and micro drilling of high frequency and high speed printed circuit board: a review. Int. J. Adv. Manuf. Technol., 2019, 100, 827–841.
  • N.-C. Lo, I.-W. Sun and P.-Y. Chen: Electrochemical preparation of porous ZnCuNi by electrodeposition in ethaline deep eutectic solvent followed by anodic or cathodic dealloying in alkaline aqueous solutions for higher nitrate reduction activity. J. Electroanal. Chem, 2021, 890, 115256.
  • Q. Chen and K. Sieradzki: Mechanisms and morphology evolution in dealloying. J. Electrochem. Soc., 2013, 160, C226–C231.
  • I. McCue, E. Benn, B. Gaskey and J. Erlebacher: Dealloying and dealloyed materials. Annu. Rev. Mater. Res., 2016, 46, 263–286.
  • N. T. Tuan, J. Park, J. Lee, J. Gwak and D. Lee: Synthesis of nanoporous Cu films by dealloying of electrochemically deposited Cu–Zn alloy films. Corros. Sci., 2014, 80, 7–11.
  • F. Jia, C. Yu, Z. Ai and L. Zhang: Fabrication of nanoporous gold film electrodes with ultrahigh surface area and electrochemical activity. Chem. Mater., 2007, 19, 3648–3653.
  • D.-S. Wang, J.-M. Song and S.-C. Lin: Mechanical properties of electrodeposited copper foils for PCB applications. 5th International Microsystems Packaging Assembly and Circuits Technology Conference, 2010, pp. 1-4, doi:10.1109/IMPACT.2010.5699518.
  • H. D. Merchant, W. C. Liu, L. A. Giannuzzi and J. G. Morris: Grain structure of thin electrodeposited and rolled copper foils. Mater Charact, 2004, 53(5), 335–360.
  • C.-C. Lin, C.-H. Yen, S.-C. Lin, C.-C. Hu and W.-P. Dow: Interactive effects of additives and electrolyte flow rate on the microstructure of electrodeposited copper foils. J Electrochem Soc, 2017, 164(13), D810.
  • S. K. Chiang, D. F. DiFranco and D. G. Pucci: High strength, low profile copper foil for high performance PCBs. Circuit World, 1995, 21(3), 56–59.
  • S. K. Hyun, K. Murakami and H. Nakajima: Anisotropic mechanical properties of porous copper fabricated by unidirectional solidification. Mater Sci Eng A, 2001, 299(1–2), 241–248.
  • M. Karimi, T. Tomkowski, G. Vidali and O. Biham: Diffusion of Cu on Cu surfaces. Physical Review B, 1995, 52, 5364.
  • K. S. W. Sing: Physisorption of gases by carbon blacks. Carbon, 1994, 32(7), 1311–1317.
  • C. Sangwichien, G. L. Aranovich and M. D. Donohue: Density functional theory predictions of adsorption isotherms with hysteresis loops. Colloids Surf, A, 2002, 206(1-3), 313–320.

Reprints and Corporate Permissions

Please note: Selecting permissions does not provide access to the full text of the article, please see our help page How do I view content?

To request a reprint or corporate permissions for this article, please click on the relevant link below:

Academic Permissions

Please note: Selecting permissions does not provide access to the full text of the article, please see our help page How do I view content?

Obtain permissions instantly via Rightslink by clicking on the button below:

If you are unable to obtain permissions via Rightslink, please complete and submit this Permissions form. For more information, please visit our Permissions help page.