References
- S. H. Lee, K. S. Kim, J. H. Shim and C.-H. Ahn: High-performance printed circuit board materials based on benzoxazine and epoxy blend system. Macromol. Res, 2018, 26, 388–393.
- J. LaDou: Printed circuit board industry. Int. J. Hyg. Environ. Health, 2006, 209(3), 211–219.
- V. A. Callcut: Coppers for electrical purposes. IEE. Proc. A, 1986, 133(4), 174–201.
- J.-C. Cho, H.-Y. Lee, S.-T. Lim, M.-S. Park, Y.-S. Oh, M.-S. Cho and Y.-K. Lee: Composition-dependent curing behavior and peel strength of epoxy resins for printed circuit boards (PCBs). Macromol. Res., 2010, 18, 47–52.
- H. Shi, X. Liu and Y. Lou: Materials and micro drilling of high frequency and high speed printed circuit board: a review. Int. J. Adv. Manuf. Technol., 2019, 100, 827–841.
- N.-C. Lo, I.-W. Sun and P.-Y. Chen: Electrochemical preparation of porous ZnCuNi by electrodeposition in ethaline deep eutectic solvent followed by anodic or cathodic dealloying in alkaline aqueous solutions for higher nitrate reduction activity. J. Electroanal. Chem, 2021, 890, 115256.
- Q. Chen and K. Sieradzki: Mechanisms and morphology evolution in dealloying. J. Electrochem. Soc., 2013, 160, C226–C231.
- I. McCue, E. Benn, B. Gaskey and J. Erlebacher: Dealloying and dealloyed materials. Annu. Rev. Mater. Res., 2016, 46, 263–286.
- N. T. Tuan, J. Park, J. Lee, J. Gwak and D. Lee: Synthesis of nanoporous Cu films by dealloying of electrochemically deposited Cu–Zn alloy films. Corros. Sci., 2014, 80, 7–11.
- F. Jia, C. Yu, Z. Ai and L. Zhang: Fabrication of nanoporous gold film electrodes with ultrahigh surface area and electrochemical activity. Chem. Mater., 2007, 19, 3648–3653.
- D.-S. Wang, J.-M. Song and S.-C. Lin: Mechanical properties of electrodeposited copper foils for PCB applications. 5th International Microsystems Packaging Assembly and Circuits Technology Conference, 2010, pp. 1-4, doi:10.1109/IMPACT.2010.5699518.
- H. D. Merchant, W. C. Liu, L. A. Giannuzzi and J. G. Morris: Grain structure of thin electrodeposited and rolled copper foils. Mater Charact, 2004, 53(5), 335–360.
- C.-C. Lin, C.-H. Yen, S.-C. Lin, C.-C. Hu and W.-P. Dow: Interactive effects of additives and electrolyte flow rate on the microstructure of electrodeposited copper foils. J Electrochem Soc, 2017, 164(13), D810.
- S. K. Chiang, D. F. DiFranco and D. G. Pucci: High strength, low profile copper foil for high performance PCBs. Circuit World, 1995, 21(3), 56–59.
- S. K. Hyun, K. Murakami and H. Nakajima: Anisotropic mechanical properties of porous copper fabricated by unidirectional solidification. Mater Sci Eng A, 2001, 299(1–2), 241–248.
- M. Karimi, T. Tomkowski, G. Vidali and O. Biham: Diffusion of Cu on Cu surfaces. Physical Review B, 1995, 52, 5364.
- K. S. W. Sing: Physisorption of gases by carbon blacks. Carbon, 1994, 32(7), 1311–1317.
- C. Sangwichien, G. L. Aranovich and M. D. Donohue: Density functional theory predictions of adsorption isotherms with hysteresis loops. Colloids Surf, A, 2002, 206(1-3), 313–320.