19
Views
0
CrossRef citations to date
0
Altmetric
Original Articles

Characteristics of antifuses with planar double dielectrics on Si1-xGex pad for field-programmable gate array

Pages 713-722 | Published online: 09 Nov 2010

References

  • Anthony , T. R. 1980 . The electromigration of liquid metal inclusions in Si . J. Appl. Phys. , 51 : 6356 – 6365 .
  • Baek , J. T. , Park , H. H. , Cho , K. I. , Yoo , H. J. , Kang , S. W. and Ahn , B. T. 1995 . Interfacial reaction in the sputter-deposited SiO2 /Ti0.1W0.9 antifuse system . J. Appl. Phys. , 78 : 7074 – 7079 .
  • Bang , D. S. , Cao , M. , Wang , A. , King , T. J. and Saraswat , K. C. 1995 . Resistivity of boron and phosphorus doped polycrystalline Si1- x Ge x films . Appl. Phys. Lett. , 66 : 195 – 197 .
  • Chiang , R. S. , Wang , T. S. , McCollum , J. , Hamdy , E. and Hu , C. Conductive channel in ONO formed by controlled dielectric breakdown . Symposium on VLSI Tech. Dig . pp. 20 – 21 .
  • Cline , H. E. and Anthony , T. R. 1976 . High-speed droplet migration in silicon . J. Appl. Phys. , 47 : 2325 – 2331 .
  • Cohen , S. S. , Raffel , J. I. and Wyatt , P. W. 1992 . A novel double-metal structure for voltage-programmable links . IEEE Electron Device Lett , 13 : 488 – 490 .
  • Cohen , S. S. , Soares , A. M. , Gleason , E. F. , Wyatt , P. W. and Raffel , J. I. 1993 . A novel metal–insulator–metal structure for field programmable devices, IEEE Trans . Electron Devices , 40 : 1277 – 1282 .
  • Gang , G. , Hu , C. , Yu , P. , Chiang , S. and Hamdy , E. 1994 . Metal-to-metal antifuses with very thin silicon dioxide films . IEEE Electron Device Lett , 15 : 310 – 312 .
  • Harari , E. 1986 . Dielectric breakdown in electrically stressed thin film of thermal SiO2 . J. Appl. Phys. , 49 : 2478 – 2489 .
  • Kim , J. , Schamiloglu , E. , Tovar , B. M. and Jungling , K. C. 1995 . Temporal measurement of plasma density variations above a semiconductor bridge (SCB) . IEEE Trans ,
  • Kim , J. , Koo , J. G. and Nam , K. S. 1997 . Two-dimensional modeling for the current density distribution in a heavily doped semiconductor resistor . Int. J. Electronics , 82 : 19 – 25 .
  • King , T. J. , McVittie , J. P. , Saraswat , K. C. and Pfiester , J. R. 1994 . Electrical properties of heavily doped polycrystalline silicon-germanium films . IEEE Trans. Electron Devices , 12 : 228 – 232 .
  • Klein , N. 1966 . The mechanism of self-heating electrical breakdown in MOS structures . IEEE Trans. Electron Devices , ED-13 : 788 – 798 .
  • Lu , C. and Shih , C. 1985 . Resistance switching characteristics in polycrystalline silicon film resistors . J. Electrochem. Soc. , 132 : 1193 – 1196 .
  • Tang , D. D. , Wong , C. and McFarland , P. A. 1992 . Metal migration into polysilicon emitter after very high current stress . IEEE Electron Device Lett , 13 : 265 – 266 .

Reprints and Corporate Permissions

Please note: Selecting permissions does not provide access to the full text of the article, please see our help page How do I view content?

To request a reprint or corporate permissions for this article, please click on the relevant link below:

Academic Permissions

Please note: Selecting permissions does not provide access to the full text of the article, please see our help page How do I view content?

Obtain permissions instantly via Rightslink by clicking on the button below:

If you are unable to obtain permissions via Rightslink, please complete and submit this Permissions form. For more information, please visit our Permissions help page.