A system for online detection and classification of wafer bin map defect patterns for manufacturing intelligence

References

• Agresti , A . 1990 . Categorical data analysis , New York : John Wiley & Sons, Inc .
   Google Scholar
• Bergeret , F and Gall , CL . 2003 . Yield improvement using statistical analysis of process dates . IEEE Transactions on Semiconducter Manufacturing , 16 ( 3 ) : 535 – 542 .
   Web of Science ®Google Scholar
• Braha , D and Shmilovici , A . 2002 . Data mining for improving a cleaning process in the semiconductor industry . IEEE Transactions on Semiconducter Manufacturing , 15 ( 1 ) : 91 – 101 .
   Web of Science ®Google Scholar
• Braha , D and Shmilovici , A . 2003 . On the use of decision tree induction for discovery of interactions in a photolithographic process . IEEE Transactions on Semiconducter Manufacturing , 16 ( 4 ) : 644 – 652 .
   Web of Science ®Google Scholar
• Carpenter , GA and Grossberg , S . 1988 . The ART of adaptive pattern recognition by a self-organization neural network . Computers , 21 ( 3 ) : 77 – 88 .
   Web of Science ®Google Scholar
• Chien , C-F . 2002 . Developing a data mining method for wafer binmap clustering and an empirical study in a semiconductor manufacturing fab . Journal of the Chinese Institute of Industrial Engineers , 19 ( 2 ) : 23 – 38 .
   Google Scholar
• Chien , C.-F. , Lee , P. and Peng , C. 2003 . Semiconductor manufacturing data mining for clustering and feature extraction . Journal of Information Management , 10 ( 1 ) : 63 – 84 .
   Google Scholar
• Chien , C-F , Wang , W and Cheng , J . 2007 . Data mining for yield enhancement in semiconductor manufacturing and an empirical study . Expert System with Applications , 33 ( 1 ) : 1 – 7 .
   Web of Science ®Google Scholar
• Eriksen , L and Prouty , K . 2001. AMR outlook: Enterprise manufacturing intelligence (EMI) – The next generation PIMS [online]. AMR Research, Inc. Available from: http://www.ien.com/printpage.aspx?id=1834 [Accessed 15 December 2009]
   Google Scholar
• Fayyad , UM , Piatetsky-Shapiro , G and Smyth , P . 1996 . “ From data mining to knowledge discovery: an overview ” . In Advances in knowledge discovery and data mining , Edited by: Fayyad , UM . 1 – 34 . Menlo Park , CA : AAAI Press .
   Google Scholar
• Friedman , DJ . 1997 . Model-free estimation of defect clustering in integrated circuit fabrication . IEEE Transactions on Semiconducter Manufacturing , 10 ( 3 ) : 344 – 359 .
   Web of Science ®Google Scholar
• Hansen , MH and Nair , VN . 1995 . Monitoring wafer map from integrated circuit fabrication processes for spatially clustered defects . Technometrics , 39 ( 3 ) : 241 – 253 .
   Web of Science ®Google Scholar
• Haykin , S . 1999 . Neural networks: A comprehensive foundation , Upper Saddle River , NJ : Prentice Hall .
   Google Scholar
• Hsu , S-C and Chien , C-F . 2007 . Hybrid data mining approach for pattern extraction from wafer bin map to improve yield in semiconductor manufacturing . International Journal of Production Economics , 107 ( 1 ) : 88 – 103 .
   Web of Science ®Google Scholar
• Hwang , JY and Kuo , W . 2007 . Model-based clustering for integrated circuit yield enhancement . European Journal of Operational Research , 178 ( 1 ) : 143 – 153 .
   Web of Science ®Google Scholar
• Hwarng , HB and Hubele , NF . 1993 . Back-propagation pattern recognisers for x-bar control charts: Methodology and performance . Computers and Industrial Engineering , 24 ( 2 ) : 219 – 235 .
   Web of Science ®Google Scholar
• Jeong , Y , Kim , S and Jeong , M . 2008 . Automatic identification of defect patterns in semiconductor wafer maps using spatial correlogram and dynamic time warping . IEEE Transactions on Semiconducter Manufacturing , 21 ( 4 ) : 625 – 637 .
   Web of Science ®Google Scholar
• Leachman , R , Ding , S and Chien , C-F . 2007 . Economic efficiency analysis of wafer fabrication . IEEE Transactions on Automation Science and Engineering , 4 ( 4 ) : 501 – 512 .
   Web of Science ®Google Scholar
• Lee , JH , You , SJ and Park , SC . 2001a . A new intelligent SOFM-based sampling plan for advanced process control . Expert Systems with Applications , 20 ( 2 ) : 133 – 151 .
   Web of Science ®Google Scholar
• Lee , JH , Yu , SJ and Park , SC . 2001b . Design of intelligent data sampling methodology based on data mining . IEEE Transactions on Robotics and Automation , 17 ( 5 ) : 637 – 649 .
   Google Scholar
• Liu , S-F , Chen , F-L and Lu , WB . 2002 . Wafer bin map recognition using a neural network approach . International Journal of Production Research , 40 ( 10 ) : 2207 – 2223 .
   Web of Science ®Google Scholar
• Mallory , CL . 1983 . Spatial yield analysis in integrated circuit manufacturing . Solid State Technology , 26 ( 11 ) : 121 – 127 .
   Web of Science ®Google Scholar
• Montgomery , DC . 2009 . Statistical quality control: A modern introduction , Hoboken , NJ : John Wiley & Sons, Inc .
   Google Scholar
• Moore , GE . 1965 . Cramming more components onto integrated circuits . Electronics , 38 ( 8 ) : 114 – 117 .
   Web of Science ®Google Scholar
• Neaga , EI and Harding , JA . 2005 . An enterprise modeling and integration framework based on knowledge discovery and data mining . International Journal of Production Research , 43 ( 6 ) : 1089 – 1108 .
   Web of Science ®Google Scholar
• Palma , FD . 2005 . Unsupervised spatial pattern classification of electrical-wafer-sorting maps in semiconductor manufacturing . Pattern Recognition , 26 ( 12 ) : 1857 – 1865 .
   Web of Science ®Google Scholar
• Peng , C and Chien , C . 2003 . Data value development to enhance yield and maintain competitive advantage for semiconductor manufacturing . Journal of Service Technology and Management , 4 ( 4–6 ) : 365 – 383 .
   Google Scholar
• Perry , MB , Spoerre , JK and Velasco , T . 2001 . Control chart pattern recognition using back propagation artificial neural networks . International Journal of Production Research , 39 ( 15 ) : 3399 – 3418 .
   Web of Science ®Google Scholar
• Pham , DT and Wani , MA . 1997 . Feature-based control chart pattern recognition . International Journal of Production Research , 35 ( 7 ) : 1875 – 1890 .
   Web of Science ®Google Scholar
• Shewhart , WA . 1931 . Economic control of quality of manufactured product , New York : Van Nostrand .
   Google Scholar
• Taam , W and Hamada , M . 1993 . Detecting spatial effects from factorial experiments: an application from integrated-circuit manufacturing . Technometrics , 35 ( 2 ) : 149 – 160 .
   Web of Science ®Google Scholar
• Wang , C-H . 2009 . Separation of composite defect patterns on wafer bin map using support vector clustering . Expert Systems with Applications , 36 ( 2 ) : 2554 – 2561 .
   Web of Science ®Google Scholar
• Western Electric Co., Inc . 1956 . Statistical quality control handbook , 2nd ed , Easton, Pennsylvania : Mack Printing Company .
   Google Scholar
• Yuan , T , Bae , SJ and Park , JI . 2010 . Bayesian spatial defect pattern recognition in semiconductor fabrication using support vector clustering . The International Journal of Advanced Manufacturing Technology , 51 ( 5–8 ) : 671 – 683 .
   Web of Science ®Google Scholar