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Original Articles

Two-Dimensional Transient Thermal Stress Analysis of Adhesive Butt Joints

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Pages 75-93 | Received 07 Jan 1999, Published online: 23 Sep 2006

References

  • Suhir , E. 1994 . “Approximate Evaluation of the Elastic Thermal Stresses in a Thin Film Fabricated on a Very Thick Circular Substrate” . ASME J. Electronic Packaging , 116 : 171 – 176 .
  • Yin , Wan-Lee . 1995 . “Interfacial Thermal Stresses in Layered Structures: The Stepped Edge Problem” . J. of Electronic Packaging , 117 : 153 – 158 .
  • Nakano , Y. , Sawa , T. and Nakagawa , F. 1992 . “Two-dimensional Thermal Stress Analysis of Butt Adhesive Joint” . JSME Intl. J. Ser. I , 35 ( 2 ) : 145 – 151 .
  • Tanigawa , Y. , Murakami , H. and Ootao , Y. 1989 . “Transient Thermal Stress Analysis of a Laminated Composite Beam” . J. Thermal Stresses , 12 : 25 – 39 .
  • King , D. and Bell , J. P. 1988 . “Thermal Shock Failure in Thick Epoxy Coatings” . J. Adhesion , 26 : 37 – 58 .
  • Kokini , K. and Smith , C. C. 1989 . “Interfacial Transient Thermal Fracture of Adhesively Bonded Dissimilar Materials” . Exper. Mechanics , 29 : 312 – 317 .
  • Carslaw , H. S. and Jaeger , J. C. 1959 . Conduction of Heat in Solids , Oxford : Oxford University Press .

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