References
- Maier , G. 2001 . Low dielectric constant polymers for microelectronics . Prog. Polym. Sci. , 26 : 3
- Huang , Y. Q. , McCormick , J. J. and Economy , J. 2005 . Adhesion of an aromatic thermosetting copolyester with copper foils . Polym. Adv. Technol. , 16 : 1
- Back , J. O. , Park , S. J. , Gong , H. J. and Kim , W. 2007 . Polyurethane modified epoxy adhesives for the application to FCCL . Macromol. Symp. , 249 : 654
- Chen , K. M. , Ho , S. M. , Wang , T. H. , King , J. S. , Chang , W. C. , Cheng , R. P. and Hung , A. 1992 . Studies on the adhesion of polyimide coatings on copper foil . J. Appl. Polym. Sci. , 45 : 947
- Chung , I. S. , Park , C. E. , Ree , M. and Kim , S. Y. 2001 . Soluble polyimides containing benzimidazole rings for interlevel dielectrics . Chem. Mater. , 13 : 2801
- Chen , H. L. , Ho , S. H. , Wang , T. H. , Chen , K. M. , Pan , J. P. , Liang , S. M. and Hung , A. 1994 . Curl-free high-adhesion polyimide/copper laminate . J. Appl. Polym. Sci. , 51 : 1647
- Ku , C. K. , Ho , C. H. , Chen , T. S. and Lee , Y. D. 2007 . Synthesis and characterization of pyridine-containing poly(imide-siloxane)s and their adhesion to copper foil . J. Appl. Polym. Sci. , 104 : 2561
- Ishii , J. , Takata , A. , Oami , Y. , Yokota , R. , Vladimirov , L. and Hasegawa , M. 2010 . Spontaneous molecular orientation of polyimides induced by thermal imidization (6). Mechanism of negative in-plane CTE generation in non-stretched polyimide films . Eur. Polym. J. , 46 : 681
- Jang , W. , Seo , M. , Seo , J. , Park , S. and Han , H. 2008 . Correlation of residual stress and adhesion on copper by the effect of chemical structure of polyimides for copper-clad laminates . Polym. Int. , 57 : 350 – 358 .
- Legros , M. , Cabié , M. and Gianola , D. S. 2009 . In situ deformation of thin films on substrates . Microsc. Res. Tech. , 72 : 270
- Ebisawa , S. , Ishii , J. , Sato , M. , Vladimirov , L. and Hasegawa , M. 2010 . Spontaneous molecular orientation of polyimides induced by thermal imidization (5). Effect of ordered structure formation in polyimide precursors on CTE . Eur. Polym. J. , 46 : 283
- Ishii , J. , Shimizu , N. , Ishihara , N. , Ikeda , Y. , Sensui , N. , Matano , T. and Hasegawa , M. 2010 . Spontaneous molecular orientation of polyimides induced by thermal imidization (4): Casting- and melt-induced in-plane orientation . Eur. Polym. J. , 46 : 69
- Brown , H. R. , Yang , A. C.M. , Russell , T. P. , Volksen , W. and Kramer , E. J. 1988 . Diffusion and self-adhesion of the polyimide PMDA-ODA . Polymer , 29 : 1807
- Rojstaczer , S. , Ree , M. , Yoon , D. Y. and Volksen , W. 1992 . Structure and properties of thin films of binary rodlike/flexible polyimide mixtures . J. Polym. Sci., Part B: Polym. Phys. , 30 : 133
- Flory , P. J. 1978 . Statistical thermodynamics of mixtures of rodlike particles. 5. Mixtures with random coils . Macromolecules , 11 : 1138
- Tomlin , D. W. , Fratini , A. V. , Hunsaker , M. and Wade Adams , W. 2000 . The role of hydrogen bonding in rigid-rod polymers: the crystal structure of a polybenzobisimidazole model compound . Polymer , 41 : 9003
- Tanaka , K. , Sano , K. I. , Katoh , T. , Iwata , S. , Nemoto , K. and Kurushima , T. 2006 . Proton- and metal cation-enhanced excited state intramolecular proton transfers of 2-(2-hydroxyfluorophenyl)benzoxazole having imidazole moiety . J. Fluorine Chem. , 127 : 1073
- Tanaka , K. , Kumagai , T. , Aoki , H. , Deguchi , M. and Iwata , S. 2001 . Application of 2-(3,5,6-Trifluoro-2-hydroxy-4-methoxyphenyl)benzoxazole and -benzothiazole to fluorescent probes sensing pH and metal cations . J. Org. Chem. , 66 : 7328
- Hu , X. D. , Jenkins , S. E. , Min , B. G. , Polk , M. B. and Kumar , S. 2003 . Rigid-rod polymers: Synthesis, processing, simulation, structure, and properties . Macromol. Mater. Eng. , 288 : 823
- Timoshenko , S. 1925 . Analysis of bi-metal thermostats . J. Opt. Soc. Am. , 11 : 233
- Curiel , T. and Fernlund , G. 2008 . Deformation and stress build-up in bi-material beam specimens with a curing FM300 adhesive interlayer . Composites Part A , 39 : 252
- Kim , Y. H. , Kim , J. , Walker , G. F. , Feger , C. and Kowalczyk , S. P. 1988 . Adhesion and interface investigation of polyimide on metals . J. Adhes. Sci. Technol. , 2 : 95
- Kim , Y. H. , Walker , G. F. , Kim , J. and Park , J. 1987 . Adhesion and interface studies between copper and polyimide . J. Adhes. Sci. Technol. , 1 : 331
- Hilborn , J. G. , Labadie , J. W. and Hedrick , J. L. 1990 . Poly(aryl ether-benzoxazoles) . Macromolecules , 23 : 2854
- Yu , Y. , Ashcroft , I. A. and Swallowe , G. 2006 . An experimental investigation of residual stresses in an epoxy-steel laminate . Int. J. Adhes. Adhes. , 26 : 511
- Lee , L. H. 1994 . Molecular bonding and adhesion at polymer-metal interphases . J. Adhes. , 46 : 15
- Miwa , T. , Tawata , R. and Numata , S. 1993 . Relationship between structure and adhesion properties of aromatic polyimides . Polymer , 34 : 621
- Iwamori , S. , Miyashita , T. , Fukuda , S. , Nozaki , S. , Sudoh , K. and Fukuda , N. 1997 . Changes in the adhesion strength between copper thin films and polyimide substrates after heat treatment . J. Adhes. Sci. Technol. , 11 : 783
- Johnson , J. S. and Evans , D. A. 2000 . Chiral Bis(oxazoline) Copper(II) Complexes: Versatile catalysts for enantioselective cycloaddition, aldol, michael, and carbonyl ene reactions . Acc. Chem. Res. , 33 : 325
- Ma , Q. J. , Zhang , X. B. , Zhao , X. H. , Gong , Y. J. , Tang , J. , Shen , G. L. and Yu , R. Q. 2009 . A ratiometric fluorescent sensor for zinc ions based on covalently immobilized derivative of benzoxazole . Spectrochim. Acta Part A , 73 : 687
- Hashemi , T. and Hogarth , C. A. 1988 . The mechanism of corrosion inhibition of copper in NaCl solution by benzotriazole studied by electron spectroscopy . Electrochim. Acta , 33 : 1123
- Ku , C. K. , Ho , C. H. and Lee , Y. D. 2005 . Synthesis of polyimides containing pyridine or triazole moiety to improve their adhesion to sputter-deposited copper . J. Adhes. Sci. Technol. , 19 : 909
- Seo , J. , Kang , J. , Cho , K. and Park , C. E. 2002 . Synthesis of polyimides containing triazole to improve their adhesion to copper substrate . J. Adhes. Sci. Technol. , 16 : 1839
- Noh , B. I. , Yoon , J. W. , Lee , B. Y. and Jung , S. B. 2010 . Effects of different kinds of seed layers and heat treatment on adhesion characteristics of Cu/(Cr or Ni–Cr)/PI interfaces in flexible printed circuits . J. Mater. Sci.: Mater. Electron. , : 1
- Choi , J. Y. , Dong , W. and Kim , Y. H. 2008 . Formation of Cu-based nanoparticles during imidization of PAA into PI in the various environments . Colloids Surf., A , 313 : 335
- Hedrick , J. L. , Russell , T. P. , Labadie , J. , Lucas , M. and Swanson , S. 1995 . High temperature nanofoams derived from rigid and semi-rigid polyimides . Polymer , 36 : 2685
- Terui , Y. , Matsuda , S. and Ando , S. 2005 . Molecular structure and thickness dependence of chain orientation in aromatic polyimide films . J. Polym. Sci., Part B: Polym. Phys. , 43 : 2109