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Original Articles

In-Situ FTIR Kinetic Study in the Silylation of Low-k Films with Hexamethyldisilazane Dissolved in Supercritical CO2

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References

  • Athens, G. L., Shayib, R. M., and Chmelka, B. F. (2009). Functionalization of mesostructured inorganic-organic and porous inorganic materials, Curr. Opin. Colloid Interface Sci., 14(4), 281.
  • Cao, C., Fadeev, A. Y., and McCarthy, T. J. (2001). Reaction of organosilanes with silica surfaces in carbon dioxide, Langmuir, 17, 757.
  • Chang, T. C., Liu, P. T., Mor, Y. S., Tsai, T. M., Chen, C. W., Meir, Y. J., Pan, F. M., Wu, W. F., and Sze, S. M. (2002). Eliminating dielectric degradation of low-k organosilicate glass by trimethylchlorosilane treatment, J. Vac. Sci. Technol. B, 20(4), 1561.
  • Clarke, M. J., Harrison, K. L., Johnston, K. P., and Howdle, S. M. (1997). Water in supercritical carbon dioxide microemulsions: spectroscopic investigation of a new environment for aqueous inorganic chemistry, J. Am. Chem. Soc., 119(27), 6399.
  • Combes, J. R., White, L. D., and Tripp, C. P. (1999). Chemical modification of metal oxide surfaces in supercritical CO2: in situ infrared studies of the adsorption and reaction of organosilanes on silica, Langmuir, 15, 7870.
  • David, C. W. (1996). IR vibration-rotation spectra of the ammonia molecule, J. Chem. Educ., 73(1), 46.
  • Gorman, B. P., Orozco-Teran, R. A., Zhang, Z., Matz, P. D., Mueller, D. W., and Reidy, R. F. (2004). Rapid repair of plasma ash damage in low-k dielectrics using supercritical CO2, J. Vac. Sci. Technol. B, 22(3), 1210.
  • Gun'ko, V. M., Vedamuthu, M. S., Henderson, G. L., and Blitz, J. P. (2000). Mechanism and kinetics of Hexamethyldisilazane reaction with a fumed silica surface, J. Colloid Interf. Sci., 228(1), 157.
  • Hage, W., Hallbrucker, A., and Mayer, E. (1993). Carbonic acid: synthesis by protonation of bicarbonate and FTIR spectroscopic characterization via a new cryogenic technique, J. Am. Chem. Soc., 115(18), 8427.
  • Himcinschi, C., Friedrich, M., Fruhauf, S., Streiter, I., Schulz, S., Gessner, T., Baklanov, M., Mognilnikov, K., and Zahn, D. (2002). Ellipsometric study of the change in the porosity of silica xerogels after chemical modification of the surface with hexamethyldisilazane, Anal. Bioanal. Chem., 374(4), 654.
  • Jones, C. A., Zweber, A., DeYoung, J. P., McClain, J. B., Carbonell, R., and DeSimone, J. M. (2004). Applications of “dry” processing in the microelectronics industry using carbon dioxide, Crit. Rev. Solid State, 29, 97.
  • Keagy, J. A., Li, Y., Green, P. F., Johnston, K. P., Weber, F., Rhoad, J. T., Busch, E. L., and Wolf, P. J. (2007). CO2 Promotes penetration and removal of aqueous hydrocarbon surfactants cleaning solutions and silylation in low-k dielectrics with 3 nm pores, J. Supercrit. Fluid., 42, 398.
  • Lin-Vien, D., Colthu, N., Fateley, W., and Grasselli, J. (1991). The Handbook of Infrared and Raman Characteristics Frequencies of Organic Molecules, 1st ed., Academic Press, San Diego, CA.
  • Meera, K., Yang, C. S., and Choi, C. K. (2006). Bonding structure and electrical properties of SiOC(-H) films deposited with a methyltrimethoxysilane precursor by using inductively coupled plasma chemical vapor deposition, J. Korean Phys. Soc., 48(6), 1713.
  • Mor, Y. S., Chang, T. C., Liu, P. T., Tsai, T. M., Chen, C. M., Yan, S. T., Chu, C. J., Wu, W. F., Pan, F. M., Lur, W., and Sze, S. M. (2002). Effective repair to ultra-low-k dielectric material (k 2.0) by hexamethyldisilazane treatment, J. Vac. Sci. Technol. B, 20(4), 1334.
  • Novotný, Z., and Biederman, H. (1989). Some properties of plasma-polymerized hexamethyldisilazane, Vacuum, 39(1), 17.
  • Perrine, K. A., and Teplyakov, A. V. (2010). Reactivity of selectively terminated single crystal silicon surfaces, Chem. Soc. Rev., 39(8), 3256.
  • Rodriguez-Reyes, J. C. F., and Teplyakov, A. V. (2007). Surface transamination reaction for tetrakis(dimethylamido) titanium with NHx-terminated Si(100) surfaces, J. Phys. Chem. C, 111(44), 16498.
  • Singh, S. K., Kumbhar, A. A., and Dusane, R. O. (2006). Repairing plasma-damages low-k HSQ films with trimethylchlorosilane treatment, Mater. Sci. Eng. B – Solid., 127, 29.
  • van Bekkum, H., Flanigen, E. M., and Jansen, J. C. (1991). Introduction to Zeolite Science and Practice, in Ch. 11, Diffusion in Zeolite Molecular Sieves, Vol. 58, Stud. Surf. Sci. Catal., Elsevier, Amsterdam, p. 391.
  • Vyhmeister, E., Valdés-González, H., Muscat, A., Suleiman, D., and Estévez, L. A. (2013). Surface modification of porous silicon-based films using dicholorosilanes dissolved in supercritical carbon dioxide, Ind. Eng. Chem. Res., 52, 4762–4771.
  • Vyhmeister, E., Reyes-Bozo, L., Valdés-González, H., Salazar, J. L., Muscat, A., Estévez, L. A., and Suleiman, D. (2014). In-situ FTIR experimental results in the silylation of low-k films with Hexamethyldisilazane dissolved in supercritical carbon dioxide, J. Supercrit. Fluid., 90, 134.
  • Xie, B., and Muscat, A. J. (2004a). Dehydration of porous MSQ (p-MSQ) using supercritical carbon dioxide and alcohol cosolvents, IEEE Trans. Semicond. Manuf., 17(4), 544.
  • Xie, B., and Muscat, A. J. (2004b). Silylation of porous methylsilsesquioxane films in supercritical carbon dioxide, Microelectron. Eng., 76, 52.
  • Xie, B., and Muscat, A. J. (2005). The restoration of porous methylsilsesquioxane (p-MSQ) films using thrimethylhalosilanes dissolved in supercritical carbon dioxide, Microelectron. Eng., 82, 434.

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