Atmospheric-temperature-based cooling system control for electronic devices using internet of things

References

• Behi, H., M. Ghanbarpour, and M. Behi. 2017. “Investigation of PCM-Assisted Heat Pipe for Electronic Cooling.” Applied Thermal Engineering. doi: 10.1016/j.applthermaleng.2017.08.109.
   PubMed Web of Science ®Google Scholar
• Colangelo, G., E. Favale, M. Milanese, A. de Risi, and D. Laforgia. 2017. “Cooling of Electronic Devices: Nanofluids Contribution.” Applied Thermal Engineering. doi: 10.1016/j.applthermaleng.2017.08.042.
   PubMed Web of Science ®Google Scholar
• EuroTech. 2017. “ Reliagate 20-25 Lightly Rugged Multi-service IoT Gateway.” http://www.eurotech.com/en/products/ReliaGATEn%2020-25.
   Google Scholar
• Ge, Y., P. Malani, and Q. Qiu. 2010. “ Distributed Task Migration for Thermal Management in Many-core Systems.” Proceedings of the 47th Design Automation Conference, Anaheim, California, USA, 579–584. ACM.
   Google Scholar
• Ghasemi, Seyed Ebrahim, A. A. Ranjbar, and M. J. Hosseini. 2017. “Experimental Evaluation of Cooling Performance of Circular Heat Sinks for Heat Dissipation from Electronic Chips Using Nanofluid.” Mechanics Research Communications. doi: 10.1016/j.mechrescom.2017.06.009.
   Web of Science ®Google Scholar
• Hanson, H., S. W. Keckler, S. Ghiasi, K. Rajamani, F. Rawson, and J. Rubio. 2007. “ Thermal Response to DVFS: Analysis with an Intel Pentium M.” Proceedings of the2007 International Symposium on Low Power Electronics and Design, Bellevue, Washington, USA, 219–224. ACM.
   Google Scholar
• Intel. 2017. "Intelligent Gateways Play a Key Role in the Internet of Things (IoT).” http://www.intel.com/content/dam/www/public/us/en/documents/solution-briefs/iot-gateway-solutions-brief.pdf.
   Google Scholar
• Khalaja, Ali Habibi, and Saman K. Halgamuge. 2017. “A Review on Efficient Thermal Management of Air- and Liquid-Cooled Data Centers: From Chip to the Cooling System.” Applied Energy 205: 1165–1188. doi: 10.1016/j.apenergy.2017.08.037
   Web of Science ®Google Scholar
• Lanzisera, S., A. R. Weber, A. Liao, D. Pajak, and A. K. Meier. 2014. “Communicating Power Supplies: Bringing the Internet to the Ubiquitous Energy Gateways of Electronic Devices.” IEEE Internet of Things Journal 1 (2): 153–160. doi: 10.1109/JIOT.2014.2307077
   Web of Science ®Google Scholar
• Madhour, Y., J. Olivier, E. Costa-Patry, S. Paredes, B. Michel, and J. R. Thome. 2010. “Two-phase Flow Boiling of R134a in a Multi-microchannel Heat Sink for Microprocessor Cooling.” IEEE 2010 16th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), 1–6.
   Google Scholar
• Madhour, Y., J. Olivier, E. Costa-Patry, S. Paredes, B. Michel, and J. R. Thome. 2011. “Flow Boiling of R134a in a Multi-Microchannel Heat Sink with Hotspot Heaters for Energy-Efficient Microelectronic CPU Cooling Applications.” IEEE Transactions on Components, Packaging and Manufacturing Technology 1 (6): 873–883. doi: 10.1109/TCPMT.2011.2123895
   Web of Science ®Google Scholar
• Mageshwaran, G., Satyanarayana Rao Polisetti, Jeya Jeevahan, and G. Britto Joseph. 2016. “Enhancement of Uniform Temperature Distribution During Casting Solidification by Methoding Process.” International Journal of Ambient Energy. doi: 10.1080/01430750.2016.1222959.
   Web of Science ®Google Scholar
• Naphon, P., S. Wiriyasart, and S. Wongwises. 2014. “Thermal Cooling Enhancement Techniques for Electronic Components.” International Communications in Heat and Mass Transfer. doi:10.1016/j.icheatmasstransfer.2014.12.005.
   Web of Science ®Google Scholar
• Skadron, K., M. R. Stan, K. Sankaranarayanan, W. Huang, S. Velusamy, and D. Tarjan. 2004. “Temperature-aware Microarchitecture: Modeling and Implementation.” ACM Transactions on Architecture and Code Optimization 1 (1): 94–125. doi: 10.1145/980152.980157.
   Google Scholar
• Tan, F. L., and C. P. Tso. 2004. “Cooling of Mobile Electronic Devices Using Phase Change Materials.” Applied Thermal Engineering 24: 159–169. doi: 10.1016/j.applthermaleng.2003.09.005
   Web of Science ®Google Scholar
• Zapater, M., J. L. Ayala, J. M. Moya, K. Vaidyanathan, K. Gross, and A. K. Coskun. 2013. “ Leakage and Temperature Aware Server Control for Improving Energy Efficiency in Data Centers.” DATE ‘13, EDA Consortium, San Jose, CA, USA, 266–269.
   Google Scholar