References
- Alshomrani, Ali S., S. Sivasankaran, A. A. Amer, and Anjan Biswas. 2019. “Numerical Study on Convective Flow in a Three-Dimensional Enclosure with Hot Solid Body and Discrete Cooling.” Numerical Heat Transfer; Part A: Applications 76 (2): 87–99. Taylor & Francis. doi: https://doi.org/10.1080/10407782.2019.1618626
- ANSYS FLUENT 13 User’s Guide. 2013. “Ansys Fluent Theory Guide.” ANSYS Inc., USA 15317 (November): 724–746.
- Baby, R., and C. Balaji. 2013. “Thermal Optimization of PCM Based pin fin Heat Sinks: an Experimental Study.” Applied Thermal Engineering. Elsevier 54 (1): 65–77. doi: https://doi.org/10.1016/j.applthermaleng.2012.10.056
- Bakkas, M., A. Amahmid, and M. Hasnaoui. 2008. “Numerical Study of Natural Convection Heat Transfer in a Horizontal Channel Provided with Rectangular Blocks Releasing Uniform Heat Flux and Mounted on its Lower Wall.” Energy Conversion and Management 49 (10): 2757–2766. Elsevier. doi: https://doi.org/10.1016/j.enconman.2008.03.017
- Beckermann, C., T. F. Smith, and B. Pospichal. 1994. “Use of a Two-Dimensional Simulation Model in the Thermal Analysis of a Multi-Board Electronic Module.” Journal of Electronic Packaging, Transactions of the ASME 116 (2): 126–133. doi: https://doi.org/10.1115/1.2905500
- Bejan, Adrian, and Enrico Sciubba. 1992. “The Optimal Spacing of Parallel Plates Cooled by Forced Convection.” International Journal of Heat and Mass Transfer 35 (12): 3259–3264. doi: https://doi.org/10.1016/0017-9310(92)90213-C
- Bhowmik, Himangshu. 2017. “Analysis of Mixed Convection Heat Transfer From Flush-Mounted Discrete Heat Sources.” International Journal of Engineering Sciences and Management III (II): 110–123. Jul–Dec 2013.
- Chiu, W. K. S., C. J. Richards, and Y. Jaluria. 2001. “Experimental and Numerical Study of Conjugate Heat Transfer in a Horizontal Channel Heated from Below.” Journal of Heat Transfer 123 (4): 688–697. doi: https://doi.org/10.1115/1.1372316
- Cole, K. D. 1997. “Conjugate Heat Transfer from a Small Heated Strip.” International Journal of Heat and Mass Transfer 40 (11): 2709–2719. doi: https://doi.org/10.1016/S0017-9310(96)00232-3
- Fujii, M., S. Gima, T. Tomimura, and X. Zhang. 1996. “Natural Convection to Air from an Array of Vertical Parallel Plates with Discrete and Protruding Heat Sources.” International Journal of Heat and Fluid Flow 17 (5): 483–490. doi: https://doi.org/10.1016/0142-727X(96)00051-3
- Furukawa, Takahiro, and Wen Jei Yang. 2003. “Thermal-Fluid Flow in Parallel Boards with Heat Generating Blocks.” International Journal of Heat and Mass Transfer 46 (26): 5005–5015. doi:https://doi.org/10.1016/S0017-9310(03)00357-0.
- Garimella, S. V., and P. A. Eibeck. 1990. “Heat Transfer Characteristics of an Array of Protruding Elements in Single Phase Forced Convection.” International Journal of Heat and Mass Transfer 33 (12): 2659–2669. doi: https://doi.org/10.1016/0017-9310(90)90202-6
- Helbing, Thomas Bezerra, and Gerhard Schmitz. 2019. “Experimental and Numerical Analysis of Composite Latent Heat Storage in Cooling Systems for Power Electronics.” Heat and Mass Transfer 55: 2949–2958. https://doi.org/10.1007/s00231-019-02593-2.
- Kargar, A., Ghasemi, B. and Aminossadati, S. M. 2011. “An Artificial Neural Network Approach to Cooling Analysis of Electronic Components in Enclosures Filled with Nanofluids”, Journal of Electronic Packaging, 133(1), p. 11010. doi: https://doi.org/10.1115/1.4003215
- Karvinkoppa, M. V., and T. K. Hotta. 2017. “Numerical Investigation of Natural and Mixed Convection Heat Transfer on Optimal Distribution of Discrete Heat Sources Mounted on a Substrate.” IOP Conference Series: Materials Science and Engineering PAPER 263: 6. doi:https://doi.org/10.1088/1757-899X/263/6/062066.
- Kumar Hotta, Tapano, C. Balaji, and S. P. Venkateshan. 2014. “Optimal Distribution of Discrete Heat Sources Under Mixed Convection—A Heuristic Approach.” Journal of Heat Transfer 136 (10): 104503. doi:https://doi.org/10.1115/1.4027350.
- Mathew, V. K., and Tapano Kumar Hotta. 2018. “Numerical Investigation on Optimal Arrangement of IC Chips Mounted on a SMPS Board Cooled under Mixed Convection.” Thermal Science and Engineering Progress 7. Elsevier: 221–229.
- Mohamed, Mousa M. 2006. “Air Cooling Characteristics of a Uniform Square Modules Array for Electronic Device Heat Sink.” Applied Thermal Engineering 26 (5–6): 486–493. doi:https://doi.org/10.1016/j.applthermaleng.2005.07.013.
- Patil, Naveen G., and Tapano Kumar Hotta. 2018a. “A Review on Cooling of Discrete Heated Modules Using Liquid Jet Impingement.” Frontiers in Heat and Mass Transfer 11. doi: https://doi.org/10.5098/hmt.11.16
- Patil, Naveen G., and Tapano Kumar Hotta. 2018b. “Role of Working Fluids on the Cooling of Discrete Heated Modules: A Numerical Approach.” Sādhanā 43: 11. doi:https://doi.org/10.1007/s12046-018-0950-7. Springer India.
- Sarper, Bugra, Mehmet Saglam, and Orhan Aydin. 2018. “Constructal Placement of Discrete Heat Sources with Different Lengths in Vertical Ducts Under Natural and Mixed Convection.” Journal of Heat Transfer 140: 12. doi:https://doi.org/10.1115/1.4041187.
- Thepsut, Warakorn, and Naris Pratinthong. 2019. “Numerical and Experimental Investigation on Heat Transfer of Multi-Heat Sources Mounted on an Array of Printed Circuit Boards in a Rectangular Case.” Applied Thermal Engineering, 156–167. doi:https://doi.org/10.1016/j.applthermaleng.2019.04.032. Elsevier Ltd
- Venkateshan, S. P. 2008. Mechanical Measurements. New Delhi, India: Ane Books.
- Wang, H. Y., and J. B. Saulnier. 1993. “A Sensitivity Study of Material Properties for Coupled Convective-Conductive Heat Transfer Generated in an Electronic Equipment.” International Journal of Heat and Mass Transfer 36 (15): 3831–3839. doi:https://doi.org/10.1016/0017-9310(93)90063-C.