Experiment and Simulation on Reduction of Postweld Shift on Butterfly-Type Laser Module by Nd:YAG Laser Welding and Separated Dual Clips

References

• Hsu, Y. C., Hong, S. P., and Hung, S. C. 2011. The reduction of postweld shift on butterfly type laser module packaging employing Nd:YAG laser and separated dual Clip: Simulation and experiment. 12th International Symposium on Laser Precision Micro/Nanofabrication, Takamatsu, Kagawa, Japan, June 7–10.
   Google Scholar
• Mueller, P., and Valk, B. 2000. Automated fiber attachment for 980nm pump modules. Proceedings of the 50th Electronic Components and Technology Conference, Las Vegas, NV, May 21–24, pp. 5–9.
   Google Scholar
• Jang, S. 2000. Automation manufacturing systems technology for opto-electronic device packaging. Proceedings of the 50th Electronic Components and Technology Conference, Las Vegas, NV, May 21–24, pp. 10–14.
   Google Scholar
• Kuang, J. H., Sheen, M. T., Wang, S. C., Wang, G. L., and Cheng, W. H. 2001. Post-weld-shift in dual-in-line laser package. IEEE Transactions on Advanced Packaging 24:81–85.
   Google Scholar
• Hsu, Y. C., Huang, W. K., Sheen, M. T., and Cheng, W. H. 2004. Fiber alignment shifts in butterfly packaging by laser welding technique: measurement and finite-element-method analysis. Journal of Electronic Materials 33:40–47.
   Web of Science ®Google Scholar
• Lin, Y., Eichele, C., and Shi, F. G. 2005. Effect of welding sequence on welding-induced-alignment-distortion in packaging of butterfly laser diode modules: Simulation and experiment. Journal of Lightwave Technology 23:615–623.
   Web of Science ®Google Scholar
• Hsu, Y. C., Tsai, Y. C., Ho, Y. L., Sheen, M. T., Kuang, J. H., and Cheng, W. H. 2005. A novel fiber alignment shift measurement and correction technique in laser-welded laser module packaging. Journal of Lightwave Technology 23:486–494.
   Web of Science ®Google Scholar
• Hsu, Y. C., Tsai, Y. C., Kuang, J. H., and Cheng, W. H. 2005. Postweld-shift-induced fiber alignment shifts in laser-welded laser module packages: Experiments and simulations. Journal of Lightwave Technology 23:4287–4295.
   Web of Science ®Google Scholar
• Alles, D. S. 1990. Trends in laser packaging. Proceedings of the 40th Electronic Components and Technology Conference, Las Vegas, NV, May 20–23, pp. 185–192.
   Google Scholar
• American Society of Materials. 1973. Low-expansion alloys. In: Metals Handbook, vol. 8, 8th ed. ASM, pp. 266–267.
   Google Scholar
• Chanchani, R., and Hall, P. M. 1990. Temperature dependence of thermal expansion of ceramics and metals for electronic packages. IEEE Transactions on Components, Hybrids, and Manufacturing Technology 13:743–750.
   Web of Science ®Google Scholar
• Suhir, E. 1994. Thermally induced stresses in an optical glass fiber soldered into a ferrule. Journal of Lightwave Technology 12:1766–1770.
   Web of Science ®Google Scholar
• Cheng, W. H., Sheen, M. T., Chang, C. M., and Tseng, Y. T. 2004. An optimum approach for reduction of fiber alignment of fiber-solder-ferrule joints in laser module packaging. Journal of Lightwave Technology 22:589–594.
   Web of Science ®Google Scholar
• Galeotti, R., Shaw, M., Musio, M., Tienforti, M., and Coppo, G. 2002. Use of glass solder in fixing an optical fiber in a laser package. Proceedings of SPIE International Society Optical Engineering 4652:142–153.
   Google Scholar
• Davis, M. K., and Echavarria, A. 2004. Polarization-induced feedback effects in fiber Bragg grating-stabilized diode lasers. Journal of Lightwave Technology 22:2816–2822.
   Web of Science ®Google Scholar
• Mobarhan, K. S., Jang, S., and Heyler, R. 2000. Laser diode packaging technology: 980 nm EDFA pump lasers for telecommunication applications. Application Note No. 7, pp. 1–9, Newport Corp., CA.
   Google Scholar
• Hsu, Y. C., and Hong, S. P. 2011. Novel butterfly type laser module packaging employing Nd:YAG laser and separated clip of stainless steel. Journal of Laser Micro/Nanoengineering 6(3):255–258.
   Web of Science ®Google Scholar