References
- Palmer , MA , Redmond , PE and Messler , RW . 2000 . Thermomechanical fatigue testing and analysis of solder alloys . Journal of Electronic Packaging , 122 : 48 – 54 .
- Tsukada , Y , Nishimura , H , Sakane , M and Ohnami , M . 2000 . Fatigue life analysis of solder joints in flip chip bonding . Journal of Electronic Packaging , 122 : 207 – 213 .
- JEDEC Board Level Drop Test Method of Components for Handheld Electronic Products, JEDEC Standard JESD22-B111, 2003.
- Gupta V, Tian J, Hartfield C, Zeng K, Cheng C. Measurement of solder joint strength and its dependence on thermal aging in freestanding and board-mounted packages using a laser spallation technique. Proceedings of the 30th International Symposium for Testing and Failure Analysis; Boston, MA; 2004. p. 267–76.
- Gupta , V , Yuan , J and Pronin , A . 1993 . Measurement of interface strength by the modified laser spallation technique. III. Experimental optimization of the stress pulse . Journal of Applied Physics , 74 : 2397 – 2404 .
- Pronin , A and Gupta , V . 1993 . Interferometry on diffuse surfaces in high-velocity measurements . Review of Scientific Instruments , 64 : 2233 – 2236 .
- Gupta , V , Yuan , J and Pronin , A . 1994 . Recent developments in the laser spallation technique to measure the interface strength and its relationship to interface toughness with applications to metal/ceramic, ceramic/ceramic and ceramic/polymer interfaces . Journal of Adhesion Science and Technology , 8 : 713 – 747 .
- Yuan , J and Gupta , V . 1995 . The effect of microstructure and chemistry on the tensile strength of Nb/sapphire interfaces with and without interlayers of Sb and Cr . Acta Metallurgica et Materialia , 43 : 781 – 794 .
- Gupta , V , Wu , J and Pronin , A . 1997 . Effect of substrate orientation, roughness, and film deposition mode on the tensile strength and toughness of niobium–sapphire interfaces . Journal of the American Ceramic Society , 80 : 3172 – 3180 .
- Gupta V, Hernandez R, Dias R, Atluri V, Raiser G, Skoglund L, Zimmerman P. Measurement of interfacial adhesion and its degradation in multi-layer packages, devices, and blanket films using the laser spallation technique. Proceedings of the 26th International Symposium for Testing and Failure Analysis; Bellevue, Washington; 2000. p. 12–6.
- Gupta , V , Atluri , V , Raiser , G , Dass , L , Seshan , K and Dias , R . 1998 . Laser spallation technique: characterization of fundamental adhesion in multilayer devices . Intel Assembly and Test Technology Journal , 1 : 23
- JEDEC BGA Ball Shear Test, JEDEC Standard JESD22-B117, 2000.
- Chiu TC, Zeng K, Stierman R, Edwards D, Ano K. Effect of thermal aging on board level drop reliability for Pb-free BGA packages. Proceeding of 2004 Electronic Components and Technology Conference; Las Vegas, NV; 2004. p. 1256–62.
- Mittal , KL . 1987 . Selected bibliography on adhesion measurement of films and coatings . Journal of Adhesion Science and Technology , 1 : 247 – 259 .
- Charalambides , PG , Lund , J , Evans , AG and McMeeking , RM . 1989 . A test specimen for determining the fracture resistance of bimaterial interfaces . Journal of Applied Mechanics , 56 : 77 – 82 .
- Volinsky , AA , Moody , NR and Gerberich , WW . 2002 . Interfacial toughness measurements for thin films on substrates . Acta Materialia , 50 : 441 – 466 .
- Xiang , Y , Chen , X , Tsui , TY , Jang , JI and Vlassak , JJ . 2006 . Mechanical properties of porous and fully dense low-κ dielectric thin films measured by means of nanoindentation and the plane-strain bulge test technique . Journal of Materials Research , 21 : 386 – 395 .