References
- Yi S, Yue CY, Hsieh JH, Fong L, Lahiri SK. Effects of oxidation and plasma cleaning on the adhesion strength of molding compounds to copper leadframes. J. Adhes. Sci. Technol. 1999;13:789–804.
- Lee HY, Qu J. Microstructure, adhesion strength and failure path at a polymer/roughened metal interface. J. Adhes. Sci. Technol. 2003;17:195–215.
- Leung S, Lam D, Luo S, Wong C. The role of water in delamination in electronic packages: degradation of interfacial adhesion. J. Adhes. Sci. Technol. 2004;18:1103–1121.
- Li Y, Moon K-S, Wong C. Adherence of self-assembled monolayers on gold and their effects for high-performance anisotropic conductive adhesives. J. Electron. Mater. 2005;34:266–271.
- Kim WS, Yun IH, Lee JJ, Jung HT. Evaluation of mechanical interlock effect on adhesion strength of polymer–metal interfaces using micro-patterned surface topography. Int. J. Adhes. Adhes. 2010;30:408–417.
- Lau D, Büyüköztürk O. Fracture characterization of concrete/epoxy interface affected by moisture. Mech. Mater. 2010;42:1031–1042.
- He P, Yuen MM. Cu/epoxy interfacial adhesion improvement by thiol-based self assembled structures of different chain lengths. In: Electronic Components and Technology Conference (ECTC), 2011 IEEE 61st; 2011 May 31–June 3; Lake Buena Vista, FL.
- Kisin S, Bozovic Vukic J, van der Varst PGT, de With G, Koning CE. Estimating the polymer-metal work of adhesion from molecular dynamics simulations. Chem. Mater. 2007;19:903–907.
- Yang S, Gao F, Qu J. Modeling of separation behavior of epoxy/Cu interface using molecular dynamics simulation. In: Electronic Components and Technology Conference (ECTC), 2011 IEEE 61st; 2011 May 31–June 3; Lake Buena Vista, FL.
- Zhou SQ, Cheng XC, Jin YL, Wu J, Zhao DS. Molecular dynamics simulation on interacting and mechanical properties of polylactic acid and attapulgite (100) surface. J. Appl. Polym. Sci. 2013;128:3043–3049.
- Youssefian S, Rahbar N. Nano-scale adhesion in multilayered drug eluting stents. J. Mech. Behav. Biomed. 2013;18:1–11.
- Wong CK, Fan H, Yuen MM. Interfacial adhesion study for SAM induced covalent bonded copper-EMC interface by molecular dynamics simulation. IEEE Trans. Compon. Packag. Technol. 2008;31:297–308.
- Yang Z, Zhao YP. Multi-scale simulation of an immobilizing F1-ATPase molecular motor. J. Korean Phys. Soc. 2008;52:1211–1216.
- Yang Z, Zhao YP. Adsorption of His-tagged peptide to Ni, Cu and Au (100) surfaces: molecular dynamics simulation. Eng. Anal. Boundary Elem. 2007;31:402–409.
- Xin D, Han Q. Investigation of moisture diffusion in cross-linked epoxy moulding compound by molecular dynamics simulation. Mol. Simul. 2013;39:322–329.
- Sun H. COMPASS: an ab initio force-field optimized for condensed-phase applications overview with details on alkane and benzene compounds. J. Phys. Chem. B. 1998;102:7338–7364.
- Zhao YP. Physical mechanics of surfaces and interfaces. In. Multiscale simulation methods for physical mechanics of surfaces and interfaces, Chapter 6; Beijing: Science Press; 2012. p. 134.
- Andersen HC. Molecular dynamics simulations at constant pressure and/or temperature. J. Chem. Phys. 1980;72:2384–2393.
- Berendsen H, Postma J, van Gunsteren W, DiNola A, Haak J. Molecular dynamics with coupling to an external bath. J. Chem. Phys. 1984;81:3684–3690.