Evaluation of coating rate and adhesive force for copper deposition on the surface of polypropylene

References

• Müller F. Johann Wilhelm Hittorf and the material culture of nineteenth-century gas discharge research. Brit J Hist Sci. 2011;44:211–244.
   PubMed Web of Science ®Google Scholar
• Chen D, Singh D, Sirkar KK, et al. Continuous polymer coating/encapsulation of submicrometer particles using a solid hollow fiber cooling crystallization method. Ind Eng Chem Res. 2014;53:6388–6400.
   Web of Science ®Google Scholar
• Wang D, Zhang Y, Lu X. Chemical formation of soft metal electrodes for flexible and wearable electronics. Chem Soc Rev. 2018;47:4611–4641.
   PubMed Web of Science ®Google Scholar
• Montmitonnet P, Delamare F, Darque-Ceretti E, et al. Paper XIX (ii) soft metallic coatings in metal forming processes. Tribology Series. 1990;17:435–444.
   Google Scholar
• Winther T, Bannerman J, Skogstad H, et al. Adhesives for adhering polystyrene plastic and their long-term effect. Stud Conserv. 2015;60:107–120.
   Web of Science ®Google Scholar
• Xu J-B, Cao Y-Q, Fang L, et al. A one-step preparation of inhibitor-loaded silica nanocontainers for self-healing coatings. Corr Sci. 2018;140:349–362.
   Web of Science ®Google Scholar
• Park K, Paulino GH, Celes W, et al. Adaptive mesh refinement and coarsening for cohesive zone modeling of dynamic fracture. Int J Numer Methods Eng. 2012;92:1–35.
   Web of Science ®Google Scholar
• Park C-N, Kirchheim R. A simple method of electroless copper plating for the preparation of metal hydride electrodes. J Alloy Comp. 1992;182:321–330.
   Web of Science ®Google Scholar
• Shu J, Grandjean BPA, Kaliaguine S. Effect of Cu(OH)2 on electroless copper plating. Ind Eng Chem Res. 1997;36:1632–1636.
   Web of Science ®Google Scholar
• Laine-Ma T, Ruuskanen P, Kortet S, et al. Electroless copper plating and surface characterization of thermoplastic PPO based printed circuit boards. Circuit World. 2009;35:22–30.
   Web of Science ®Google Scholar
• Grigoriev D, Shchukina E, Shchukin DG. Nanocontainers for self-healing coatings. Adv Mater Interfaces. 2017;4:1600318.
   Web of Science ®Google Scholar
• Tian Q-h, Guo X-y. Electroless copper plating on microcellular polyurethane foam. Trans Nonferrous Met Soc China. 2010;20:s283–s287.
   Web of Science ®Google Scholar
• Kato H, Nakamura A, Takahashi K, et al. Accurate size and size-distribution determination of polystyrene latex nanoparticles in aqueous medium using dynamic light scattering and asymmetrical flow field flow fractionation with multi-angle light scattering. Nanomaterials. 2012;2:15–30.
   Web of Science ®Google Scholar
• Nazir MH, Khan Z, Stokes K. Modelling of metal-coating delamination incorporating variable environmental parameters. J Adhes Sci Technol. 2015;29:392–423.
   Web of Science ®Google Scholar
• Tang J, Wang J, Xie X, et al. Surface coating reduces degradation rate of magnesium alloy developed for orthopaedic applications. J Orthop Translat. 2013;1:41–48.
   Google Scholar
• Zafar U, Hare C, Hassanpour A, et al. Drop test: a new method to measure the particle adhesion force. Powder Technol. 2014;264:236–241.
   Web of Science ®Google Scholar
• Chen H, Ruckenstein E. Nanomembrane containing a nanopore in an electrolyte solution: A molecular dynamics approach. J Phys Chem Lett. 2014;5:2979–2982.
   PubMed Web of Science ®Google Scholar
• Kaewvilai A, Tanathakorn R, Laobuthee A, et al. Electroless copper plating on nano-silver activated glass substrate: a single-step activation. Surf Coat Technol. 2017;319:260–266.
   Web of Science ®Google Scholar
• Pearson RG. Hard and soft acids and bases. J Am Chem Soc. 1963;85:3533–3539.
   Web of Science ®Google Scholar
• Fulazzaky MA. Determining the resistance of mass transfer for adsorption of the surfactants onto granular activated carbons from hydrodynamic column. Chem Eng J. 2011;166:832–840.
   Web of Science ®Google Scholar
• Zhong S, Hepworth MT. A calculation method for determining equilibria in metal-ammonia-water systems. Hydrometallurgy. 1995;38:15–37.
   Web of Science ®Google Scholar
• Molnár I, Takács N, Kurin-Csörgei K, et al. Some general features in the autocatalytic reaction between sulfite ion and different oxidants. Int J Chem Kinet. 2013;45:462–468.
   Web of Science ®Google Scholar
• Zhao Y, Wang Y, Shi J. Steady states and dynamics of an autocatalytic chemical reaction model with decay. J Differ Equ. 2012;253:533–552.
   Web of Science ®Google Scholar
• Thanh NTK, Maclean N, Mahiddine S. Mechanisms of nucleation and growth of nanoparticles in solution. Chem Rev. 2014;114:7610–7630.
   PubMed Web of Science ®Google Scholar
• Ogura T, Malcomson M, Fernando Q. Mechanism of copper deposition in electroless plating. Langmuir. 1990;6:1709–1710.
   Web of Science ®Google Scholar
• Khan A, Rashid A, Younas R, et al. A chemical reduction approach to the synthesis of copper nanoparticles. Int Nano Lett. 2016;6:21–26.
   Web of Science ®Google Scholar
• Mishra KG, Paramguru RK. Kinetics and mechanism of electroless copper deposition at moderate-to-high copper ion and low-to-moderate formaldehyde concentrations. Metall Materi Trans B. 1999;30:223–229.
   Web of Science ®Google Scholar
• Gordon R, Drum RW. The chemical basis of diatom morphogenesis. Int Rev Cytol. 1994;150:243–372.
   Web of Science ®Google Scholar
• Crabtree RH. Homogeneous transition metal catalysis of acceptorless dehydrogenative alcohol oxidation: applications in hydrogen storage and to heterocycle synthesis. Chem Rev. 2017;117:9228–9246.
   PubMed Web of Science ®Google Scholar
• Swain CG, Powell AL, Sheppard WA, et al. Mechanism of the Cannizzaro reaction. J Am Chem Soc. 1979;101:3576–3583.
   Web of Science ®Google Scholar
• Brostow W, Chen IK, Hnatchuk N, et al. Enhanced adhesion of polypropylene to copper substrates. Polymer Testing. 2017;63:158–162.
   Web of Science ®Google Scholar
• Tonozuka Y, Shohji I, Koyama S, et al. Degradation behaviors of adhesion strength between epoxy resin and copper under aging at high temperature. Proc Eng. 2017;184:648–654.
   Google Scholar
• Di Cioccio L, Gueguen P, Taibi R, et al. An overview of patterned metal/dielectric surface bonding: mechanism, alignment and characterization. J Electrochem Soc. 2011;158:P81–P86.
   Web of Science ®Google Scholar
• Balart J, Fombuena V, Balart R, et al. Optimization of adhesion properties of polypropylene by surface modification using acrylic acid photografting. J Appl Polym Sci. 2010;116:3256–3264.
   Web of Science ®Google Scholar
• Huang R, Ge H, Lin X, et al. Facile one-pot preparation of α-SnWO4/reduced graphene oxide (RGO) nanocomposite with improved visible light photocatalytic activity and anode performance for Li-ion batteries. RSC Adv. 2013;3:1235–1242.
   Web of Science ®Google Scholar
• Michiels Y, Puyvelde P, Sels B. Barriers and chemistry in a bottle: mechanisms in today’s oxygen barriers for tomorrow’s materials. Appl Sci. 2017;7:665.
   Google Scholar
• Langowskia H-C. Surface modification of polymer films for improved adhesion of deposited metal layers. J Adhes Sci Technol. 2011;25:223–243.
   Web of Science ®Google Scholar
• Su W, Yao L, Yang F, et al. Electroless plating of copper on surface-modified glass substrate. Appl Surf Sci. 2011;257:8067–8071.
   Web of Science ®Google Scholar
• Urbaniak-Domagala W. Pretreatment of polypropylene films for the creation of thin polymer layers, part 1: the use of chemical, electrochemical, and UV methods. J Appl Polym Sci. 2011;122:2071–2080.
   Web of Science ®Google Scholar
• Gawande MB, Goswami A, Felpin F-X, et al. Cu and Cu-based nanoparticles: synthesis and applications in catalysis. Chem Rev. 2016;116:3722–3811.
   PubMed Web of Science ®Google Scholar
• Delgado K, Quijada R, Palma R, et al. Polypropylene with embedded copper metal or copper oxide nanoparticles as a novel plastic antimicrobial agent. Lett Appl Microbiol. 2011;53:50–54.
   PubMed Web of Science ®Google Scholar
• Borhade AV, Kankrej SR. An efficient cost-effective removal of Ca2+, Mg2+, and Cu2+ ions from aqueous medium using chlorosodalite synthesized from coal fly ash. J Chem Eng Data. 2017;62:596–607.
   Web of Science ®Google Scholar
• Wu S. Preparation of fine copper powder using ascorbic acid as reducing agent and its application in MLCC. Mater Lett. 2007;61:1125–1129.
   Web of Science ®Google Scholar
• Shao L, Zhang B, Zhang W, et al. The role of palladium dynamics in the surface catalysis of coupling reactions. Angew Chem Int Ed. 2013;52:2114–2117.
   PubMed Web of Science ®Google Scholar
• van Meerakker J, Scholtens E. Side reactions in electroless copper solutions with formaldehyde as reducing agent. Berichte Der Bunsengesellschaft Für Physikalische Chemie. 1989;93:786–791.
   Google Scholar
• Belakhmima RA, Errahmany N, Ebn Touhami M, et al. Preparation and characterization of electroless Cu-P deposition protection for mild steel corrosion in molar hydrochloric solution. J Assoc Arab Univ Basic Appl Sci. 2017;24:46–53.
   Google Scholar
• Shin D, Lee Y, Sasaki M, et al. Violation of Ohm’s law in a Weyl metal. Nat Mater. 2017;16:1096–1099.
   PubMed Web of Science ®Google Scholar
• Konishi Y, Nomura T, Satoh D. Solvothermal preparation of cuprous oxide fine particles by hydrolysis of copper(II) carboxylate in two-phase liquid − liquid system. Ind Eng Chem Res. 2004;43:2088–2092.
   Web of Science ®Google Scholar
• Gasab MTI, Sugawara H, Sato T, et al. Tube inner coating of non-conductive films by pulsed reactive coaxial magnetron plasma with outer anode. Coatings. 2018;8:115.
   Web of Science ®Google Scholar
• Kondili E, Kontominas M, Kosmas M. The effect of stirring on the diffusion of small molecules from a polymer matrix into a solution. Polymer. 1993;34:2592–2596.
   Web of Science ®Google Scholar
• Fulazzaky MA, Khamidun MH, Omar R. Understanding of mass transfer resistance for the adsorption of solute onto porous material from the modified mass transfer factor models. Chem Eng J. 2013;228:1023–1029.
   Web of Science ®Google Scholar