A new ultrasonic electrochemical potential activation method to enhance the adhesion strength between electroforming layer and Cu substrate

References

• Moscha F, Stiros S. Experimental evaluation of the performance of arrays of MEMS accelerometers. Mech Syst Signal Pr. 2019;116:933–942.
   Web of Science ®Google Scholar
• Hayber SE, Tabaru TE, Saracoglu OG. A novel approach based on simulation of tunable MEMS diaphragm for extrinsic fabry perot sensors. Opt Commun. 2019;430:14–23.
   Web of Science ®Google Scholar
• Akbari M, Ghassemi M. A new slip velocity suitable for natural gas flows in energy applications. Energ Source Part A. 2019;41(9):1116–1123.
   Google Scholar
• Maruthi GS, Hegde V. Application of MEMS accelerometer for detection and diagnosis of multiple faults in the roller element bearings of three phase induction motor. IEEE Sens J. 2018;419:123–139.
   Google Scholar
• Chen X, Zhong W, Li C, et al. Development of a Contactless Air Conveyor system for transporting and positioning planar objects. Micromachines. 2018;9(10):487.
   PubMed Web of Science ®Google Scholar
• Xiang N, Ni ZH, Yi H. Concentration-controlled particle focusing in spiral elasto inertial microfluidic devices. Electrophoresis. 2018;39(2):417–424.
   PubMed Web of Science ®Google Scholar
• Zhang K, Gan N, Hu FT. Microfluidic electrophoretic non-enzymatic kanamycin assay making use of a stirring bar functionalized with gold-labeled aptamer, of a flurescent dna probe, and of signal amplification via hybridization chain reaction. Microchim Acta. 2018;185:1811–1819.
   Web of Science ®Google Scholar
• Mali SA, Nune KC, Misra RDK. Biomimetic nanostructured hydroxyapatite coatings on metallic implant materials. Mater Technol. 2016;31(13):782–790.
   Web of Science ®Google Scholar
• Nevers A, Hallez L, Touyeras F, et al. Use of Ultrasound to modified electrodeposited silver and silver tin microstructures and composition without chemical additives. ECS Trans. 2017;77(11):865–873.
   Google Scholar
• Choi CY, Zheng Z, Wong KW, et al. Fabrication of cross linked multi walled carbon nanotube coatings with improved adhesion and intrinsic strength by a two step synthesis: electrochemical deposition and hyperthermal proton bombardment. Appl Phys A. 2008;91(3):403–406.
   Web of Science ®Google Scholar
• Zhao M, Du LQ, Qi LJ, et al. Numerical simulations and electrochemical experiments of the mass transfer of microvias electroforming under ultrasonic agitation. Ultrason Sonochem. 2018;48:424–431.
   PubMed Web of Science ®Google Scholar
• Karousos DS, Desdenakis KI, Sakkas PM, et al. Sonoelectrochemical one-pot synthesis of Pt - Carbon black nanocomposite PEMFC electrocatalyst. Ultrason Sonochem. 2017;35(B):591–597.
   PubMed Web of Science ®Google Scholar
• Zhao Z, Du LQ. Quantitative relationship between crystallite size and adhesion strength of electroforming layer during micro electroforming process. Micro & Nano Lett. 2015;10(2):64–66.
   Web of Science ®Google Scholar
• Zhao Z, Chen J, Li C, et al. Reducing the internal compressive stress of the microelectroformed layer by adjusting the current densities. Micro & Nano Lett. 2019;14(11):1178–1181.
   Web of Science ®Google Scholar
• Court S, Kerr C, Ponce de León C, et al. Monitoring of zincate pretreatment of aluminium prior to electroless nickel plating. Int J Surf Eng Coat. 2017;95(2):97–105.
   Google Scholar
• Narayanan R, Kim SY, Kwon TY, et al. Nanocrystalline hydroxyapatite coatings from ultrasonated electrolyte: preparation, characterization, and osteoblast responses. J Biomed Mater Res A. 2010;87:1503–1060.
   Google Scholar
• Wang H, Liu R, Jiang WQ, et al. A novel method for improving the adhesion strength of the electrodeposited Ni films in MEMS. Appl Surf Sci. 2011;257(6):2203–2207.
   Web of Science ®Google Scholar
• Feng SB, Shang SB, Xiang B, et al. Study of potential activation phenomenon and initial process of the metal electrodeposition. Acta Phys-Chim Sin. 2005;21(5):463–467.
   Web of Science ®Google Scholar
• Shao LG, Wang LD, Du LQ. Influence of initial current density on bonding strength between Ni layer and Cu substrate in micro electroforming. J Adhes Sci Technol. 2016;30(18):2013–2023.
   Web of Science ®Google Scholar
• Wei C, Zhang YH, Song RX, et al. Ultrasonic assisted pulse electrodeposited Ni-doped TiN coatings. Ceram Inter. 2018;44(12):14767–14773.
   Web of Science ®Google Scholar
• Unal E, Karahan IH. Effects of ultrasonic agitation prior to deposition and additive in the bath on electrodeposited Ni-B/hBN composite coatings. J Alloy Compd. 2018;763:329–341.
   Web of Science ®Google Scholar
• Touyeras F, Hihn JY, Bourgoin X, et al. Effects of ultrasonic irradiation on the properties of coatings obtained by electroless plating and electro plating. Ultrason Sonochem. 2005;12(1–2):13–19.
   PubMed Web of Science ®Google Scholar
• Yang YC, Chang E. Influence of residual stress on bonding strength and fracture of plasma-sprayed hydroxyapatite coatings on Ti-6Al-4V substrate. Biomaterials. 2001;22(13):1827–1836.
   PubMed Web of Science ®Google Scholar
• Zhao Z, Zhu PC, Yang LC, et al. Effect of dislocation density on adhesion strength of electroforming Ni layer on Cu substrate. J Adhes Sci Technol. 2019;33(3):301–313.
   Web of Science ®Google Scholar
• Shao LG, Du LQ, Wang LD. Enhancing the adhesion strength between Cu substrate and Ni layer in microelectroforming. Mater Manuf Process. 2014;29(7):795–800.
   Web of Science ®Google Scholar
• Zhao Z, Du LQ, Xu Z, et al. Effects of ultrasonic agitation on adhesion strength of micro electroforming Ni layer on Cu substrate. Ultrason Sonochem. 2016;29:1–10.
   PubMed Web of Science ®Google Scholar
• Kasach AA, Kurilo II, Kharitonov DS, et al. Sonochemical electrodeposition of copper coatings. Russ J Appl Chem. 2018;91(2):207–213.
   Web of Science ®Google Scholar
• Zhang ZB, Gao TT, Liu XY, et al. Influence of sound directions on acoustic field characteristics within a rectangle-shaped sonoreactor: numerical simulation and experimental study. Ultrason Sonochem. 2018;42:787–794.
   PubMed Web of Science ®Google Scholar
• Zhao Z, Du LQ, Tao YS, et al. Enhancing the adhesion strength of micro electroforming layer by ultrasonic agitation method and the application. Ultrason Sonochem. 2016;33:10–17.
   PubMed Web of Science ®Google Scholar
• Zhao Z, Du LQ, Tan ZC. Influence of electrodeposited crystallite size on interfacial adhesion strength of electroformed layers. Micro & Nano Lett. 2014;9(2):73–76.
   Web of Science ®Google Scholar