Design and reliability analysis of a novel wafer level package with stress buffer mechanism

References

• Badihi , A. 2000 . “Ultrathin Wafer Level Chip Size Package,” . IEEE Transactions on Advanced Packaging , 23 ( 2 ) : 212 – 214 .
   Google Scholar
• Chang , K.C. and Chiang , K.N. 2003 . “Solder Joint Reliability Analysis of a Wafer‐Level CSP Assembly with Cu Studs Formed on Solder Pads,” . Journal of the Chinese Institute of Engineers , 26 ( 4 ) : 467 – 479 .
   Web of Science ®Google Scholar
• Chiang , K.N. and Yuan , C.A. 2001 . “An Overview of Solder Bump Shape Prediction Algorithm with Validations,” . IEEE Transactions on Advanced Packaging , 24 ( 2 ) : 158 – 162 .
   Google Scholar
• Chiang , K.N. , Lin , Y.T. and Cheng , H.C. 2000 . “On Enhancing Eutectic Solder Joint Reliability Using a Second‐Reflow‐Process Approach,” . IEEE Transactions on Advanced Packaging , 23 ( 1 ) : 9 – 14 .
   Google Scholar
• Chiang , K.N. , Liu , Z.N. and Peng , C.T. 2001 . “Parametric Reliability Analysis of No‐Underfill Flip Chip Package,” . IEEE Transactions on Components and Packaging Technologies , 24 ( 4 ) : 635 – 640 .
   Google Scholar
• Coffin , L.F. Jr. 1954 . “A Study of the Effects of Cyclic Thermal Stresses on a Ductile Metal,” . Transactions of the ASME , 76 : 931 – 950 .
   Google Scholar
• Garrou , P. 2000 . “Wafer Level Chip Scale Packaging (WL‐CSP): An Overview,” . IEEE Transactions on Advanced Packaging , 23 ( 2 ) : 198 – 205 .
   Google Scholar
• Kang , I.S. , Kim , J.H. , Park , I.S. , Hur , K.R. and Cho , S.J. “The Solder Joint and Runner Metal Reliability of Wafer‐Level CSP (Omega‐CSP),” . Proceedings of the 50th IEEE Electronic Components and Technology Conference . Las Vegas, NV, USA. pp. 87 – 92 .
   Google Scholar
• Kelkar , N. , Mathew , R. and Nguyen , L. 2000 . “MicroSMD‐A Wafer Level Chip Scale Package,” . IEEE Transactions on Advanced Packaging , 23 ( 2 ) : 227 – 232 .
   Google Scholar
• Kim , T. , Lee , D.H. , Lee , J.K. , Ahn , P.S. , Kang , B.U. , Moon , H.S. and Choi , C. H. “Thermo‐Mechanical Behavior of Elastomer for CSP and Reliability,” . Proceedings of IEEE International Symposium on 2001 ISIE . Pusan, South Korea. Vol. 2 , pp. 701 – 706 .
   Google Scholar
• Lin , C.T. and Chiang , K.N. 2004 . “Reliability Analysis of Flip Chip Packages Using the Contact Finite Element Method,” . Journal of the Chinese Institute of Engineers , 27 ( 2 ) : 165 – 172 .
   Web of Science ®Google Scholar
• Lin , Y.T. , Peng , C.T. and Chiang , K.N. 2002 . “Parametric Design and Reliability Analysis of Wire Interconnect Technology Wafer Level Packaging,” . Transactions ASME, Journal of Electronic Packaging , 124 ( 3 ) : 234 – 239 .
   Web of Science ®Google Scholar
• Manson , S.S. 1965 . “Mechanics,” . Experimental Mechanics , 5 : 193 – 226 .
   Google Scholar
• Mercador , L.L. , Sarihan , V. , Guo , Y. and Mawer , A. 2000 . “Impact of Solder Pad Size on Solder Joint Reliability in Flip Chip PBGA Packages,” . IEEE Transactions on Advanced Packaging , 23 ( 3 ) : 415 – 420 .
   Google Scholar
• Solomon , H.D. 1986 . “Fatigue of 60/40 Solder,” . IEEE Transactions on Components and Hybrids and Manufacturing Technology , 9 ( 4 ) : 423 – 432 .
   Google Scholar
• Xu , F.Y. , Bymark , R. and Hsu , B.L. “A Novel Epoxy Encapsulant for CSP(μBGA)‐New Hydrophobic Epoxy Elastomer,” . 2000 International Symposium on Advanced Packaging Materials . Braselton, GA, USA. pp. 83 – 89 .
   Google Scholar
• Yamaguchi , Y. , Kazama , A. , Satoh , T. , Anjoh , I. and Nishimura , A. “Development of Low‐Cost Highly Reliable Wafer Process Package,” . Proceedings of the 51st IEEE Electronic Components and Technology Conference . Orlando, FL, USA. pp. 40 – 46 .
   Google Scholar
• Zhang , L. , Chee , S.S. and Maheshwari , A. “Effect of Solder Ball Pad Design on Cavity Down BGA Solder Joint Reliability,” . Proceedings of the 52nd IEEE Electronic Components and Technology Conference . San Diego, CA, USA. pp. 1001 – 1006 .
   Google Scholar
• Corresponding author. (Tel: 886–3–5742925; Fax: 886–3–5745377; Email: [email protected])
   Google Scholar