References
- Ramli MII, Saud N, Salleh MAAM, et al. Effect of TiO2 additions on Sn-0.7Cu-0.05Ni lead-free composite solder. Microelectron Reliab. 2016;65:255–264.
- Satyanaryan Prabhu KN. Reactive wetting, evolution of interfacial and bulkIMCs and their effect onmechanical properties of eutectic Sn-Cu solder alloy. Adv Colloid Interface Sci. 2011;166:87–118.
- Rizvi MJ, Bailey C, Chan YC, et al. Effect of adding 0.3 wt% Ni into the Sn-0.7 wt% Cu solder, Part I: wetting behavior on Cu and Ni substrates. J Alloys Compd. 2007;438(1–2):116–121.
- Li LF, Cheng YK, Xu GL, et al. Effects of indium addition on properties and wettability of Sn-0.7Cu-0.2Ni lead-free solders. Mater Des. 2014;64:15–20.
- Wu CML, Yu DQ, Law CMT, et al. Properties of lead-free solder alloys with rare earth element additions. Mater Sci Eng R. 2004;44:1–44.
- Yang L, Zhang YC, Dai J, et al. Microstructure, interfacial IMC and mechanical properties of Sn-0.7Cu-xAl (x=0-0.075) lead-free solder alloy. Mater Des. 2015;67:209–216.
- Shen J, Pu YY, Wu D, et al. Effects of minor Bi, Ni on the wetting properties, microstructures, and shear properties of Sn-0.7Cu lead-free solder joints. J Mater Sci Mater Electron. 2015;26:1572–1580.
- Mahdavifard MH, Sabri MFM, Said SM, et al. Effects of Fe and Bi minor alloying on mechanical, thermal, and microstructural properties of Sn-0.7Cu solder alloy. J Electronic Mater. 2016;45(7):3673–3682.
- Zeng G, McDonald SD, Gu Q, et al. The influence of Ni and Zn additions on microstructure and phase transformations in Sn-0.7Cu/Cu solder joints. Acta Mater. 2015;83:357–371.
- Li GD, Shi YW, Hao H, et al. Effect of phosphorus element on the comprehensive properties of Sn-Cu lead-free solder. J Alloys Compd. 2010;491:382–385.
- Huang HZ, Lu D, Shuai GW, et al. Effects of phosphorus addition on the corrosion resistance of Sn-0.7Cu lead-free solder alloy. Trans Indian Inst Met. 2016;69:1537–1543.
- Huang HZ, Shuai GW, Wei XQ, et al. Effects of sulfur addition on the wettability and corrosion resistance of Sn-Cu lead-free solder. Microelectron Reliab. 2017;74:15–21.
- El-Daly AA, El-Taher AM, Gouda S. Novel Bi-containing Sn-1.5Ag-0.7Cu lead-free solder alloy with further enhanced thermal property and strength for mobile products. Mater Des. 2015;65:796–805.
- Jaffery HA, Sabri MFM, Said SM, et al. Electrochemical corrosion behavior of Sn-0.7Cu solder alloy with the addition of bismuth and iron. J Alloys Compd. 2019;810:151925.
- Osório WR, Freitas ES, Spinelli JE, et al. Electrochemical behavior of a lead-free Sn-Cu solder alloy in NaCl solution. Corros Sci. 2014;80(3):71–81.
- Li DZ, Conway PP, Liu CQ. Corrosion characterization of tin-lead and lead free solders in 3.5 wt.% NaCl solution. Corros Sci. 2008;50:995–1004.
- Huang HZ, Wei XQ, Liao FP, et al. Preparation and properties of particle reinforced Sn-Zn-based composite solder. J Wuhan Univ Technol (Mater Sci Ed). 2009;24:206–209.
- Nazeri MFM, Yahaya MZ, Gursel A, et al. Corrosion characterization of Sn-Zn solder: a review. Solder Surf Mt Technol. 2019;31(1):52–67.
- Liyana NK, Fazal MA, Haseeb ASMA. Polarization and EIS studies to evaluate the effect of aluminum concentration on the corrosion behavior of SAC105 solder alloy. Mater Sci-Poland. 2018;35(4):694–701.
- Hansen M. Constitution of binary alloys. New York (NY): McGraw-Hill Book Co; 1958. p. 634.
- Alam SN, Mishra MK, Padhy M, et al. Development and characterization of Sn-Zn-Bi lead free solder. Trans Indian Inst Met. 2015;68(5):881–896.
- Huang ML, Wang L. Effects of Cu, Bi, and In on microstructure and tensile properties of Sn-Ag-X (Cu, Bi, In) solders. Metall Trans A. 2005;36A(6):1439–1446.
- Xu BS, Chen JW, Yuan ZF, et al. Spreading dynamics and interfacial characteristics of Sn-3.0Ag-0.5Cu-xBi melting on Cu substrates. Microgravity Sci Technol. 2016;28:115–122.
- Sasaki T, Kanagawa R, Ohtsuka T, et al. Corrosion products of tin in humid air containing sulfur dioxide and nitrogen dioxide at room temperature. Corros Sci. 2003;45:847–854.
- Wierzbricka-Miernik A, Guspiel J, Zabdyr L. Corrosion behavior of lead-free SAC-type solder alloys in liquid media. Arch Civil Mech Eng. 2015;15(1):206–213.
- Mori M, Miura K, Sasaki T, et al. Corrosion of tin alloys in sulfuric and nitric acids. Corros Sci. 2002;44:887–898.
- Nazeri MFM, Mohamad AA. Corrosion resistance of ternary Sn-9Zn-xIn solder joint in alkaline solution. J Alloys Compd. 2016;661:516–525.
- Nurwahida MZ, Mukridz MM, Ahmad AM, et al. Corrosion properties of SAC305 solder in different solution of HCl and NaCl. IOP Conf Ser: Mater Sci Eng. 2018;318:012004.
- Liu JC, Wang ZH, Xie JY, et al. Effects of intermetallic-forming element additions on microstructure and corrosion behavior of Sn-Zn solder alloys. Corros Sci. 2016;112:150–159.
- Liyana NK, Fazal MA, Haseeb A, et al. Effect of Zn incorporation on the electrochemical corrosion properties of SAC105 solder alloys. J Mater Sci Mater Electron. 2019;30(8):7415–7422.