391
Views
9
CrossRef citations to date
0
Altmetric
Research Articles

An investigation of the effect of pulse electrochemical deposition parameters on morphology, hardness and corrosion behaviour in the marine atmosphere

ORCID Icon, ORCID Icon, ORCID Icon, & ORCID Icon
Pages 1021-1032 | Received 02 Jan 2019, Accepted 15 Apr 2019, Published online: 23 May 2019

References

  • Baral A, Sarangi CK, Tripathy BC, et al. Copper electrodeposition from sulfate solutions – effects of selenium. Hydrometallurgy. 2014;146:8–14. doi: 10.1016/j.hydromet.2014.03.001
  • Augustin A, Hedge A. Electron microscopic study of nodules formed during electrodeposition of copper on aluminium. Mater Sci. 2015;2:371–374.
  • Augustin A, Huilgol P, Udupa KR. Effect of current density during electrodeposition on microstructure and hardness of textured Cu coating in the application of antimicrobial Al touch surface. J Mech Behav Biomed Mater. 2016;63:352–360. doi: 10.1016/j.jmbbm.2016.07.013
  • Nikiforov AY, Deng X, Onyshchenko I, et al. Atmospheric pressure plasma deposition of antimicrobial coatings on non-woven textiles. Eur Phys J Appl Phy. 2016;75(2):24710. doi: 10.1051/epjap/2016150537
  • Qu NS, Zhu D, Chan KC, et al. Pulse electrodeposition of nano crystalline nickel using ultra narrow pulse width and high peak current density. Surf Coat Technol. 2003;168(2–3):123–128. doi: 10.1016/S0257-8972(03)00014-8
  • Roos JR, Celis JP, Fransaer J, et al. The development of composite plating for advanced materials. JOM. 1990;42(11):60–63. doi: 10.1007/BF03220440
  • Zhang X, Tu KN, Zhong C, et al. High-Temperature stability of silicon carbide nanowires. J Nanosci Nanotechnol. 2008;8(8):3999–4002. doi: 10.1166/jnn.2008.452
  • Balasubramanian A, Srikumar DS, Raja G, et al. Effect of pulse parameter on pulsed electrodeposition of copper on stainless steel. Surf Eng. 2009;25(5):389–392. doi: 10.1179/026708408X344680
  • Subramanian M, Dhanikaivelu N, Rama Prabha R. Pulsed electrodeposition of cobalt and nickel alloy. Trans IMF. 2007;85(5):274–280. doi: 10.1179/174591907X229644
  • Mohan S, Rajasekaran N. Pulse electrodeposition of tin from sulphate bath. Surf Eng. 2009;25(8):634–638. doi: 10.1179/026708408X383957
  • Chandrasekar MS, Pushpavanam M. Pulse and pulse reverse plating – conceptual, advantages and applications. Electrochem Acta. 2008;53:3313–3322. doi: 10.1016/j.electacta.2007.11.054
  • Imaz N, Garcia licina E, Suarez C, et al. Influence of additives and plating parameters on morphology and mechanical properties of copper coatings obtained by pulse electrodeposition. Trans IMF. 2009;87(2):64–71. doi: 10.1179/174591909X424807
  • Sivasakthi P, Sekar R. Pulse electrodeposited nickel using sulphamate electrolyte for hardness and corrosion resistance. Mater Res Bull. 2015;70:832–839. doi: 10.1016/j.materresbull.2015.06.019
  • Krivosudska M. Pulse current electrodeposition and corrosion properties of Ni–W alloy coatings. J Appl Electrochem. 2011;41:1077–1085. doi: 10.1007/s10800-011-0331-y
  • Marro JB, Darroudi T, Okoro CA, et al. The influence of pulse plating frequency and duty cycle on the microstructure and stress state of electroplated copper films. Thin Solid Films. 2017;621:91–97. doi: 10.1016/j.tsf.2016.11.047
  • Sharma A, Bhattacharya S, Das S, et al. A study on the effect of pulse electrodeposition parameters on the morphology of pure tin coatings. Metall Mater Sci. 2014;45(10):4610–4622.
  • Yingwu Y, Manman Z, Chunmei H, et al. Influence of duty cycle on the structure and electro catalytic properties of pulse electrodeposited lead dioxide electrodes. J Solid State Electrochem. 2014;18(3):721–727. doi: 10.1007/s10008-013-2308-8
  • Vaghela V, Shah K N, et al. Enhancement in surface morphology by pulsed electro deposition of pure silver on Al alloy. Int J Sci Res Educ. 2017;5(12):170–175.
  • Mohan S, Rajasekaran N. Influence of electrolyte pH on composition, corrosion properties and surface morphology of electrodeposited Cu–Ni alloy. Surf Eng. 2011;27(7):519–523. doi: 10.1179/026708410X12786785573472
  • Greisen D, Kulkarni M, Baker M, et al. Effects of electrochemistry on surface roughness during chemical-mechanical polishing of copper. Tribol Lett. 2007;25(1):33–41.
  • Zhen L, Jiding Z, Jiarui C. The influence of critical flow velocity on corrosion of stainless steel. J Fail Anal Prev. 2017;17(6):1234–1240. doi: 10.1007/s11668-017-0369-1
  • Mohan S, Raj V. The effect of additives on the pulsed electrodeposition of copper. Trans IMF. 2005;83(4):194–198. doi: 10.1179/002029605X61595
  • FerozKhan P, Shanthi V, Barik RC, et al. Effect of benzotriazole on corrosion inhibition of copper under flow conditions. J Environ Chem Engg. 2015;3(1):10–19. doi: 10.1016/j.jece.2014.11.005
  • Liu J, Bakedashi W, Li Z, et al. Effect of flow velocity on erosion–corrosion of 90-degree horizontal elbow. Wear. 2017;376:516–525. doi: 10.1016/j.wear.2016.11.015
  • Walsh FC, Low C. A review of developments in the electrodeposition of tin-copper alloys. Surf Coat Technol. 2016;304:246–262. doi: 10.1016/j.surfcoat.2016.06.065
  • Bahrololoom ME, Sani R. The influence of pulse plating parameters on the hardness and wear resistance of nickel – alumina composite coatings. Surf Coat Technol. 2005;192:154–163. doi: 10.1016/j.surfcoat.2004.09.023
  • Adelkhani H, Mohammad RA. Properties of Fe–Ni–Cr alloy coatings by using direct and pulse current electrodeposition. J Alloys Comp. 2009;476(1–2):234–237. doi: 10.1016/j.jallcom.2008.09.108
  • Lajevardi SA, Shahrabi T. Effects of pulse electrodeposition parameters on the properties of Ni – TiO2 nanocomposite coatings. Appl Surf Sci. 2010;256(22):6775–6781. doi: 10.1016/j.apsusc.2010.04.088
  • Alrahim A, Shikshak A, Mansour AA, et al. Effect of flow velocity of sea water on corrosion rate of low carbon steel. Appl Mech Mater. 2015;799-800:232–236. doi: 10.4028/www.scientific.net/AMM.799-800.232
  • Choudhary RK, Kain V, Hubli RC. Stirring effects on aluminium coatings electrodeposited in ionic liquids. Surf Eng. 2017;30(8):562–567. doi: 10.1179/1743294414Y.0000000278
  • Chen Z, et al. Nanoindentation of porous bulk and thin films of La0.6Sr0.4Co0.2Fe0.8O3−δ. Acta Mater. 2013;61(15):5720–5734. doi: 10.1016/j.actamat.2013.06.016
  • Suresh S, Nieh T-G, Choi BW. Nano-indentation of copper thin films on silicon substrates. Scr Mater. 1999;41(9):951–957. doi: 10.1016/S1359-6462(99)00245-6
  • Palza H, Delgado K, Curotto N. Synthesis of copper nanostructures on silica based particles for antimicrobial organic coatings. Appl Surf Sci. 2015;357:86–90. doi: 10.1016/j.apsusc.2015.08.260
  • Mohd Y, Zaki MHM, Mohamad SAS. Characterisation of copper coating electrodeposited on stainless steel substrate. Int J Electrochem Sci. 2017;12(7):6010–6021.
  • Schlesinger M, Milan P. Modern electroplating. Vol. 55. New York: Wiley; 2011.
  • Wang X, Cao LA, Guang Y, et al. Study of direct Cu electrodeposition on ultra-thin Mo for copper interconnects. Microelectron Eng. 2016;164:7–13. doi: 10.1016/j.mee.2016.07.001
  • Chang T, Jin Y, Wen L, et al. Synergistic effects of gelatin and convection on copper foil electrodeposition. Electrochim Acta. 2016;211:245–254. doi: 10.1016/j.electacta.2016.06.051
  • Shanthi C, Barathan S, Jaiswal R, et al. The effect of pulse parameters in electro deposition of silver alloy. Mater Lett. 2008;62(30):4519–4521. doi: 10.1016/j.matlet.2008.08.032
  • Wharton JA, Wood RJK. Influence of flow conditions on the corrosion of AISI 304L stainless steel. Wear. 2004;256:525536 . doi: 10.1016/S0043-1648(03)00562-3
  • Zhen L, Jiding Z. The influence of flow velocity on electrochemical reaction of metal surface. IOP Conf Ser: Mater Sci Eng. 2017;274(1):1–6.
  • Wang Y, Bierwagen GP. A new acceleration factor for the testing of corrosion protective coatings : flow-induced coating degradation. J Coat Technol. 2009;6(4):429–436. doi: 10.1007/s11998-008-9161-1
  • Rivera FF, Nava L. Mass transport studies at rotating cylinder electrode (RCE) influence of using plates and concentric cylinder as counter electrodes. Electrochem Acta. 2007;52:5868–5872. doi: 10.1016/j.electacta.2007.03.014
  • Rivero EP, Granados P, Rivera FF, et al. Mass transfer modeling and simulation at a rotating cylinder electrode (RCE) reactor under turbulent flow for copper recovery stainless steel. Chem Eng Sci. 2010;65:3042–3049. doi: 10.1016/j.ces.2010.01.030

Reprints and Corporate Permissions

Please note: Selecting permissions does not provide access to the full text of the article, please see our help page How do I view content?

To request a reprint or corporate permissions for this article, please click on the relevant link below:

Academic Permissions

Please note: Selecting permissions does not provide access to the full text of the article, please see our help page How do I view content?

Obtain permissions instantly via Rightslink by clicking on the button below:

If you are unable to obtain permissions via Rightslink, please complete and submit this Permissions form. For more information, please visit our Permissions help page.