References
- Pijls NH, De Bruyne B, Peels K, et al. Measurement of fractional flow reserve to assess the functional severity of coronary-artery stenoses. N Engl J Med. 1996;334:1703–1708.
- Tonino PA, De Bruyne B, Pijls NH, FAME Study Investigators, et al. Fractional flow reserve versus angiography for guiding percutaneous coronary intervention. N Engl J Med. 2009;360:213–224.
- Park SJ, Ahn JM, Park GM, et al. Trends in the outcomes of percutaneous coronary intervention with the routine incorporation of fractional flow reserve in real practice. Eur Heart J. 2013;34:3353–3361.
- Jung-Min Ahn, Duk-Woo Park, Eun-Seok Shin, et al. Fractional flow reserve and cardiac events in coronary artery disease. Circulation. 2017;135:2241–2251.
- MortonKern. Comparing FFR Tools: New Wires and a Pressure Microcatheter. Cath Lab Digest. 2016;24:1–7.
- Cook CM, Ahmad Y, Shun-Shin MJ, et al. Quantification of the effect of pressure wire drift on the diagnostic performance of fractional flow reserve, instantaneous wave-free ratio, and whole-cycle Pd/Pa. Circ Cardiovasc Interv. 2016;9:e002988.
- Mahfoz-Kotb H, Salaün AC, Mohammed-Brahim T, et al. Polycrystalline silicon thin films for MEMS applications. Thin Solid Films. 2003;427:422–426.
- Witvrouw A, Du Bois B, De Moor P, et al. Comparison between wet HF etching and vapor HF etching for sacrificial oxide removal. Micromachining and microfabrication process technology VI. Proceedings of SPIE - The International Society for Optical Engineering. 4174; 2000 Aug 25.
- Hangas J, Liu D, Oei D, et al. The effect of deposition temperature on the mcrostructure of Lpcvd polysilicon films. MRS Mater Res Soc Proc. 1991;239:93. DOI:10.1557/PROC-239-93.
- Dougherty GM, Sands TD, Pisano AP. Microfabrication using one-step LPCVD porous polysilicon films. J Microelectromech Syst. 2003;12:418–424.
- Simard-Normandin M, Emesh I, D'asti G, et al. Characterization of silicon oxide films deposited using tetraethylorthosilicate. Can J Phys. 1989;67:199–206.
- Chen Z, Rohatgi A, Ruby D. Silicon surface and bulk defect passivation by low temperature PECVD oxides and nitrides. Photovoltaic energy conversion. In: Conference record of the twenty fourth IEEE photovoltaic specialists conference, 1994 IEEE first world conference. IEEE. 1994. p. 1331–1334.
- MAS6510 Capacitive Sensor Signal Conditioner IC. Manufactured by Micro Analog Systems Oy (MAS), Finland. Available from: https://www.mas-oy.com/portfolio/mas6510/