Thermal, Mechanical and Electrical Properties of Linear Low-Density Polyethylene Composites Filled with Different Dimensional SiC Particles

REFERENCES

• Zhou , W.Y. ; Qi , S.H. ; Tu , C.C. Novel heat-conductive composite silicone rubber . J. Appl. Polym. Sci. 2007 , 104 , 2478 .
   Web of Science ®Google Scholar
• Lu , X. ; Xu , G. Thermally conductive polymer composites for electronic packaging . J. Appl. Polym. Sci. 1997 , 65 , 2733 .
   Web of Science ®Google Scholar
• Zhou , W.Y. ; Qi , S.H. ; Tu , C.C. ; Zhao , H.Z. ; Wang , C.F. ; Kou , J.L. Effect of the particle size of Al2O3 on the properties of filled heat-conductive silicone rubber . J. Appl. Polym. Sci. 2007 , 104 , 1312 .
   Web of Science ®Google Scholar
• Gonon , P. ; Sylvestre , A. ; Teysseyre , J. ; Prior , C. Dielectric properties of epoxy/silica composites used for microlectronic packaging, and their dependence on post-curing . J. Mater. Sci. 2001 , 12 , 81 .
   Google Scholar
• Lehmann , B. ; Schlarb , A.K. ; Friedrich , K. ; Zhang , M.Q. ; Rong , M.Z. Modelling of mechanical properties of nanoparticle-filled polyethylene . Int. J. Polym. Mater. 2008 , 57 , 81 .
   Web of Science ®Google Scholar
• Bhardwaj , P. ; Singh , S. ; Singh , V. ; Aggarwal , S. ; Mandal , U.K. Nanosize polyacrylamide/SiO2 composites by inverse microemulsion polymerization . Int. J. Polym. Mater. 2008 , 57 , 404 .
   Web of Science ®Google Scholar
• Nikje , M.M.A. ; Tehrani , Z.M. ; Garmarudi , A.B. ; Haghshenas , M. Chemical treatment of silica nanoparticles by diethanolamine and gamma-glycidoxypropyltrimethoxysilane and application of modified nanoparticles in epoxy-based composites . Polym-Plast. Technol. & Eng. 2009 , 48 , 891 .
   Web of Science ®Google Scholar
• Lee , G.W. ; Park , M. ; Kim , J.K. ; Lee , J.I. ; Yoon , H.G. Enhanced thermal conductivity of polymer composites filled with hybrid filler . Composites Part A. 2006 , 37 , 727 .
   Web of Science ®Google Scholar
• Luo , Y.J. ; Dang , J. ; Qi , H.Y. ; Li , H.R. Studies on preparation and property researches of EP/SiC thermal conductivity composites . Polym-Plast. Technol. Eng. 2009 , 48 , 877 .
   Web of Science ®Google Scholar
• Yung , K.C. ; Zhu , B.L. ; Wu , J. ; Yue , T.M. ; Xie , C.S. Effect of AlN content on the performance of brominated epoxy resin for printed circuit board substrate . J. Appl. Polym. Sci. Pt. B 2007 , 45 , 1662 .
   Google Scholar
• Zhou , W.Y. ; Qi , S.H. ; An , Q.L. ; Zhao , H.Z. ; Liu , N.L. Thermal conductivity of boron nitride reinforced polyethylene composites . Mater. Res. Bull. 2007 , 42 , 1863 .
   Web of Science ®Google Scholar
• Zhou , W.Y. ; Yu , D.M. ; An , Q.L. A novel polymeric coating with high thermal conductivity . Polym-Plast. Technol. Eng. 2009 , 48 , 1230 .
   Web of Science ®Google Scholar
• Ye , C.M. ; Shentu , B.Q. ; Weng , Z.X. Thermal conductivity of high density polyethylene filled with graphite . J. Appl. Polym. Sci. 2006 , 101 , 3806 .
   Web of Science ®Google Scholar
• Gao , J.F. ; Li , Z.M. ; Peng , S. ; Yan , D.X. Temperature-resistivity behaviour of CNTs/UHMWPE composites with a two-dimensional conductive network . Polym-Plast. Technol. Eng. 2009 , 48 , 478 .
   Web of Science ®Google Scholar
• Xu , Z.B. ; Zhang , Y.Q. ; Hong , W.R. ; Zheng , S.X. Electric conductivity and thermorheology properties of polyacrylonitrile/nylon6 composites filled with carbon black . Polym.-Plast. Technol. Eng. 2009 , 48 , 280 .
   Web of Science ®Google Scholar
• Agari , Y. ; Shimada , M. ; Ueda , A. Thermal diffusivity and conductivity of PS/PPO blends . Polymer 1997 , 38 , 2649 .
   Google Scholar
• Agari , Y. ; Ueda , A. ; Nagai , S. Thermal conductivities of composites in several types of dispersion systems . J. Appl. Polym. Sci. 1991 , 42 , 1665 .
   Web of Science ®Google Scholar
• Yu , S.Z. ; Hing , P. ; Hu , X. Thermal conductivity of polystyrene–aluminum nitride composite . Compos. Pt. A 2002 , 33 , 289 .
   Web of Science ®Google Scholar
• Ratnam , C.T. ; Hill , D.J.T. ; Rasoul , F. ; Whittaker , A.K. ; Keen , I. Surface plasma modification of LLDPE for biomedical applications . Polym.-Plast. Technol. Eng. 2010 , 49 , 1 .
   Google Scholar
• Zhou , W.Y. ; Yu , D.M. ; Min , C. ; Fu , Y.P. ; Guo , X.S. Thermal, dielectric, and mechanical properties of SiC particles filled linear low-density polyethylene composites . J. Appl. Polym. Sci. 2009 , 112 , 1695 .
   Web of Science ®Google Scholar
• Luyt , A.S. ; Molefi , J.A. ; Krump , H. Thermal, mechanical and electrical properties of copper powder filled low-density and linear low-density polyethylene composites . Polym. Degrad. Stabil. 2006 , 91 , 1629 .
   Web of Science ®Google Scholar
• Zhou , W.Y. ; Qi , S.H. ; Li , H.D. ; Shao , S.Y. Study on insulating thermal conductive BN/HDPE composites . Thermochim. Acta 2007 , 452 , 36 .
   Web of Science ®Google Scholar