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Research Article

Dielectric and Thermal Behavior of Polystyrene/Sr2TiMnO6 (STMO) Composites

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Pages 96-102 | Received 24 Aug 2020, Accepted 18 Jan 2021, Published online: 04 Jun 2021

References

  • M. Biron, Thermoplastics and Thermoplastic Composites, Elsevier, Oxford, UK (2013).
  • Q. Li, J. Liu, X. Zhang, S. Tan, J. Lu and Z. Zhang, Phys. Chem. Chem. Phys., 21, 15712-15724 (2019). doi: 10.1039/C9CP01798D
  • S. Zhang, C. Zou, X. Zhou, D. Anderson, B. Zellers and Q. Zhang, “Polymer Film Capacitors with High Dielectric Constant, High Capacitance Density, and High Energy Density,” pp. 221-224 in: IEEE Int. Power Modulator and High Voltage Conf., Atlanta, GA (2010).
  • Y. Thakur, T. Zhang, C. Iacob, T. Yang, J. Bernholc, L. Q. Chen, J. Runt and Q. M. Zhang, Nanoscale, 9, 10992-10997 (2017). doi: 10.1039/C7NR01932G
  • A. Arya, M. Sadiq and A. L. Sharma, Ionics, 24, 2295-2319 (2018). doi: 10.1007/s11581-017-2364-7
  • D. Luo, J. Wu, Y. Ni, C. Wang and N. Zhao, Trans. Indian Ceram. Soc., 78, 34-40 (2019). doi: 10.1080/0371750X.2019.1583134
  • T. Sundararajan, S. Abirami, P. Manohar and S. T. Aruna, Trans. Indian Ceram. Soc., 71, 25-30 (2012). doi: 10.1080/0371750X.2012.689508
  • J. Bian, Q. Zhao, Z. Hou, J. Dong, Q. Yang and G. Zhang, R. Soc. Open Sci., 6, 181509 (2019). doi: 10.1098/rsos.181509
  • L. Zhang, J. Zhao, E.-Q. Huang, J.-W. Zha and Z.-M. Dang, J. Appl. Polym. Sci., 132, 41398 (2015).
  • Z. M. Dang, T. Zhou, S. H. Yao, J. K. Yuan, J. W. Zha, H. T. Song, J. Y. Li, Q. Chen, W. T. Yang and J. Bai, Adv. Mater., 21, 2077-2082 (2009). doi: 10.1002/adma.200803427
  • R. M. Wallace, “Dielectric Materials for Microelectronics,” pp. 615-643 in: Springer Handbook of Electronic and Photonic Materials, 2nd edition, Eds. S. Kasap and P. Capper, Springer International Publishing AG, Cham, Switzerland (2017).
  • S. A. Riquelme, K. Ramam and A. F. Jaramillo, Results Phys., 15, 102800 (2019). doi: 10.1016/j.rinp.2019.102800
  • K. Silakaew, W. Saijingwong, K. Meeporn, S. Maensiri and P. Thongbai, Microelectron. Eng., 146, 1-5 (2015). doi: 10.1016/j.mee.2015.01.029
  • Z. M. Dang, Y. Zheng and H. P. Xu, J. Appl. Polym. Sci., 110, 3473-3479 (2008). doi: 10.1002/app.28856
  • K. Ashok, B. Masin, H. Sreemoolanadhan and M. Mathew, Trans. Indian Ceram. Soc., 78, 131-136 (2019). doi: 10.1080/0371750X.2019.1632226
  • B. Keswani, S. Patil and Y. Kolekar, Trans. Indian Ceram. Soc., 78, 108-110 (2019). doi: 10.1080/0371750X.2019.1619483
  • B. R. Kumar, N. V. Prasad, G. Prasad and G. S. Kumar, Trans. Indian Ceram. Soc., 78, 89-93 (2019). doi: 10.1080/0371750X.2019.1610068
  • S. Pandey, O. Parkash and D. Kumar, Trans. Indian Ceram. Soc., 77, 209-218 (2018). doi: 10.1080/0371750X.2018.1526653
  • M. Wang, Y. Wang, W. Hao, P. Xu, Q. Tan, S. Yang, L. Sun, E. Cao and Y. Zhang, Trans. Indian Ceram. Soc., 77, 1-4 (2018). doi: 10.1080/0371750X.2018.1518729
  • L. Wang, Y. Di, H. Wang, X. Li, L. Dong and T. Liu, Trans. Indian Ceram. Soc., 78, 212-218 (2019). doi: 10.1080/0371750X.2019.1690582
  • C. S. Devi and G. Prasad, Trans. Indian Ceram. Soc., 77, 67-72 (2018). doi: 10.1080/0371750X.2018.1452633
  • P. Sharma, K. L. Singh, A. P. Singh, C. Sharma and S. Mago, Trans. Indian Ceram. Soc., 78, 20-23 (2019). doi: 10.1080/0371750X.2019.1578695
  • H. Liu, C. Jie, Y. Ma, Z. Wang and X. Wang, Trans. Indian Ceram. Soc., 79, 83-87 (2020). doi: 10.1080/0371750X.2020.1722754
  • V. Veenachary, E. V. Ramana, G. S. Kumar, G. Prasad and N. V. Prasad, Trans. Indian Ceram. Soc., 79, 113-119 (2020). doi: 10.1080/0371750X.2020.1760139
  • P. Thomas, A. Ashokbabu, R. S. E. Ravindran and R. Vaish, IEEE Trans. Dielectr. Electr. Insul., 26, 568-575 (2019). doi: 10.1109/TDEI.2019.007578
  • P. Thomas, A. Ashokbabu and R. Vaish, J. Therm. Anal. Calorim., 141, 1123-1135 (2020). doi: 10.1007/s10973-019-09105-8
  • Q. Li, F.-Z. Yao, Y. Liu, G. Zhang, H. Wang and Q. Wang, Ann. Rev. Mater. Res., 48, 219-243 (2018). doi: 10.1146/annurev-matsci-070317-124435
  • S. Shalu, P. Kar, J. Krupka and B. D. Ghosh, Polym. Compos., 39, E1714-E1724 (2018). doi: 10.1002/pc.24711
  • S. Moharana and R. N. Mahaling, J. Aust. Ceram. Soc., 56, 751-760 (2020). doi: 10.1007/s41779-019-00393-9
  • P. K. Paul, S. A. Hussain, D. Bhattacharjee and M. Pal, Bull. Mater. Sci., 36, 361-366 (2013). doi: 10.1007/s12034-013-0498-4
  • P. Sen, K. Suresh, R. N. Kumar, M. Kumar and G. Pugazhenthi, J. Sci.: Adv. Mater. Dev., 1, 311-323 (2016).
  • V. S. Puli, R. Elupula, B. C. Riggs, S. M. Grayson, R. S. Katiyar and D. B. Chrisey, Int. J. Nanotechnol., 11, 910-920 (2014). doi: 10.1504/IJNT.2014.063798
  • K. R. S. PreethiMeher and K. B. R. Varma, J. Appl. Phys., 105, 034113 (2009). doi: 10.1063/1.3077270
  • P. Thomas, B. S. Dakshayini, H. S. Kushwaha and R. Vaish, J. Adv. Dielect., 5, 1550018 (2015). doi: 10.1142/S2010135X15500186
  • P. Arulmurugan, N. A. Manikandan and G. Pugazhenthi, Macromol. Symp., 382, 1800078 (2018). doi: 10.1002/masy.201800078
  • J. Aseeri, N. M. Alandis, W. Mekhamer and M. Alam, Open Chem., 17, 927-935 (2019). doi: 10.1515/chem-2019-0095
  • P. Badheka, V. Magadala, N. G. Devaraju, B. I. Lee and E. S. Kim, J. Appl. Polym. Sci., 99, 2815-2821 (2006). doi: 10.1002/app.22890
  • R. Kota and B. I. Lee, J. Mater. Sci.: Mater. Electron., 18, 1221-1227 (2007).
  • M. R. Jung, F. D. Horgen, S. V. Orski, C. V. Rodriguez, K. L. Beers, G. H. Balazs, T. T. Jones, T. M. Work, K. C. Brignac, S.-J. Royer, K. D. Hyrenbach, B. A. Jensen and J. M. Lynch, Mar. Pollut. Bull., 127, 704-716 (2018). doi: 10.1016/j.marpolbul.2017.12.061
  • S. Peng, Q. Zeng, X. Yang, J. Hu, X. Qiu and J. He, Sci. Rep., 6, 38978 (2016). doi: 10.1038/srep38978
  • S. Siddabattuni, T. P. Schuman and F. Dogan, ACS Appl. Mater. Interf., 5, 1917-1927 (2013). doi: 10.1021/am3030239
  • A. Sanida, S. G. Stavropoulos, Th. Speliotis and G. C. Psarras, Polymer, 120, 73-81 (2017). doi: 10.1016/j.polymer.2017.05.043
  • C. Behera, R. N. P. Choudhary and P. R. Das, J. Mater. Sci.: Mater. Electron., 28, 2586-2597 (2017).
  • M. Khutia, G. M. Joshi, K. Deshmukh and M. Pandey, Compos. Interf., 22, 167-178 (2015). doi: 10.1080/15685543.2015.999215
  • Z. Zhang, Y. Gu, S. Wang, M. Li, J. Bi and Z. Zhang, Compos. Part A: Appl. Sci. Manuf., 74, 88-95 (2015). doi: 10.1016/j.compositesa.2015.04.002
  • L. Cheng, P. Yan, X. Yang, H. Zou, H. Yang and H. Liang, J. Alloy. Compd., 825, 154132 (2020). doi: 10.1016/j.jallcom.2020.154132
  • L. Cheng, P. Yan, X. Yang, H. Zou, H. Yang and H. Liang, Mater. Chem. Phys., 247, 122869 (2020). doi: 10.1016/j.matchemphys.2020.122869
  • L. Liu, H. Fan, P. Fang and L. Jin, Solid State Commun., 142, 573-576 (2007). doi: 10.1016/j.ssc.2007.04.005
  • L. Liu, H. Fan, L. Fang, H. Dammak and M. Pham-Thi, J. Electroceram., 28, 144-148 (2012). doi: 10.1007/s10832-012-9695-6
  • J. Deng, L. Liu, X. Sun, S. Liu, T. Yan, L. Fang and B. Elouadi, Mater. Res. Bull., 88, 320-329 (2017). doi: 10.1016/j.materresbull.2017.01.005

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