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IETE Journal of Research Volume 23, 1977 - Issue 9
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Original Articles

Material Interaction Problems in Semiconductor Devices & Integrated Circuits

A. K. SinhaQuality Assurance Division, VSSC, ISRO, Trivandrum695 022.
Pages 575-576 | Received 15 Dec 1976, Published online: 10 Jul 2015

REFERENCES

  • Philofsky (E). Purple Plague Revisited. 8th Annual Proceedings Reliability Physics 1970. P 177–185.
  • Horsting (CW). Purple Plague and Gold Purity. 10th Annual Proceedings Reliability Physics 1972. P 155–158.
  • Philofsky (E). Design Limits when Using Gold-Aluminium Bonds. 9th Reliability Physics Symposium 1971. P 114–119.
  • Black (JR). Physics of Electromigration (Abstract). International Reliability Physics Symposium 1974.
  • Blech (IA) and Meieren (ES). Electromigration in Integrated Circuits. Proc. Reliability Physics Symposium 1970, P 243–250.
  • Venables (JD) and Lye (R G). A Statistical Model for Electromigration Induced Failure in Thin-Film Conductors. Proc. 10th Reliability Physics Symposium 1972. P 159–164.
  • Sinha (AK) and Mathur (MC). The Use of Scanning Electron Microscope in the Failure Analysis of a Typical Semiconductor Device. QR Journal. 3, 2; 1976; 71–73.
  • Sinha (A K) and Mathur (M C). Role of Failure Analysis in Reliability Improvement of Electronic Components. Seminar on Reliability in Electronics, Bangalore. Sept. 1976
  • Schanble (G L) and Keen (R S). Metallization and Bonds: A Review of Failure Mechanisms. Reliability Physics 1968. P 170–187.

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