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Letters to the Editor

Decapsulation Of Silicone Potted Electronic Assemblies

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Pages 21-22 | Received 08 Apr 1980, Published online: 11 Jul 2015

REFERENCES

  • Prise (W J). Electronic Circuit Packaging, 1967. E.E. Merrill Books Inc., Columbus Ohio. 1.
  • Dallinore & (G R). Advances in Electronic Circuit Packaging, 5 Ed. L.L. Rosine. 1965, Plenum Press, NYP, 1.
  • Clough (W L) & Collin (J M). Micro electronics. 3, 11; 1971; 4.
  • Lockhurt (F J). Advances in Electronic Circuit Packaging. 5, Ed. L.L. Rosine, 1965, Plenum Press, N.Y. P 106.
  • Davis (B A). Advances in Electronic Circuit Packaging. 2, Ed. L.L. Rosine, 1965, Plenum Press. NY, P 77.
  • “Uresolve Plus” Tech, Bull 6–73, Dynalog Inc. 7Great Meadow Lane, Hanover N.J., U.S.A.
  • Noll (W). Chemistry and Technology of Silicones. 1968, Academic Press, P 512.

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