Novel Subthreshold Modelling of Advanced On-Chip Graphene Interconnect Using Numerical Method Analysis

References

• G. Dhillon and N. Raghu, “Performance analysis of single-wall carbon nanotubes and copper as VLSI interconnect,” Int. J. Sci. Technol., vol. 9, no. 1, pp. 1–6, 2016.
   Google Scholar
• J. Rabaey, Digital Integrated Circuits: A Design Perspective, 2nd ed. Berkeley: Prentice-Hall, 2004.
   Google Scholar
• F. Liang, G. Wang, and H. Lin, “Modeling of crosstalk effect in MWCNT interconnect,” IEEE Trans. Electromagn. Compat., vol. 54, no. 1, pp. 133–139, 2012. doi: 10.1109/TEMC.2011.2172982
   Web of Science ®Google Scholar
• C. Xu, H. Li, and K. Banerjee, “Modeling, analysis and design of GNR interconnects,” IEEE Trans. Electron Devices, vol. 56, no. 8, pp. 1567–1578, 2009. doi: 10.1109/TED.2009.2024254
   Web of Science ®Google Scholar
• H. Li, C. Xu, N. Srivastava, and K. Banerjee, “Carbon nanomaterials for next-generation interconnects and passives: Physics, status, and prospects,” IEEE Trans. Electron Devices, vol. 56, no. 9, pp. 1799–1821, 2009. doi: 10.1109/TED.2009.2026524
   Web of Science ®Google Scholar
• A. K. Nishad and R. Sharma, “Analytical time domain models for performance optimization of multi-layer GNR interconnects,” IEEE J. Sel. Top. Quantum Electron., vol. 20, no. 1, pp. 1–8, 2014. doi: 10.1109/JSTQE.2013.2272458
   Web of Science ®Google Scholar
• A. K. Nishad and R. Sharma, “Self-consistent capacitance model for multiplayer graphene nanoribbon interconnects,” Macro Nano Lett, vol. 10, no. 8, pp. 404–407, 2015. doi: 10.1049/mnl.2015.0017
   Web of Science ®Google Scholar
• V. Kumar, S. Rakheja, and A. Naeemi, “Performance and energy-perbit modeling of multilayer graphene nanoribbon conductors,” IEEE Trans. Electron Devices, vol. 59, no. 10, pp. 2753–2761, 2012. doi: 10.1109/TED.2012.2208753
   Web of Science ®Google Scholar
• F. Yuan, CMOS Current-Mode Circuits for Data Communications. New York: Springer Publication, 2007.
   Google Scholar
• Y. Ho, H. K. Chen, and C. Su, “Energy-effective sub-threshold interconnect design using high-boosting predrivers,” IEEE J. Emerg. Sel. Top. Circuits Syst., vol. 2, no. 2, pp. 307–313, 2012. doi: 10.1109/JETCAS.2012.2193841
   Web of Science ®Google Scholar
• R. Dhiman and R. Chandel, “Dynamic crosstalk analysis in coupled interconnects for ultra-low power applications,” Circuits Syst. Signal Process, vol. 34, pp. 21–40, 2015. doi: 10.1007/s00034-014-9853-y
   Web of Science ®Google Scholar
• 12. M. Sahoo and H. Rahaman, “An ABCD parameter based modeling and analysis of crosstalk induced effects in multilayer graphene nano-ribbon interconnects,” in Proc. IEEE Conference on Circuit and Systems, 2014.
   Google Scholar
• N. S. Murthy and M. Kavicharan, “A survey on FDTD-based interconnect modeling,” J. Circuits Syst. Comput, vol. 24, no. 1, pp. 153001–32, 2015. doi: 10.1142/S0218126615300019
   Web of Science ®Google Scholar
• V. R. Kumar, B. K. Kaushik, and A. Patnaik, “Improved crosstalk noise modeling of MWCNT interconnects using FDTD technique, Microelectron. J., vol. 46, no. 12, pp. 1263–1268, 2015. doi: 10.1016/j.mejo.2015.10.009
   Web of Science ®Google Scholar
• D. K. Sharma, B. K. Kaushik, and R. K. Sharma, “Delay model for dynamically switching coupled RLC interconnects,” EPJ Appl. Phys., vol. 66, no. 1, pp. 1–6, 2014. doi: 10.1051/epjap/2014130375
   Google Scholar
• X. C. Li, J. F. Mao, and M. Swaminathan, “Transient analysis of CMOS-gate-driven RLGC interconnects based on FDTD,” IEEE Trans. Comput. Aided Design Integr Circuits Syst, vol. 30, no. 4, pp. 574–583, 2011. doi: 10.1109/TCAD.2010.2095650
   Web of Science ®Google Scholar
• V. R. Kumar, B. K. Kaushik, and A. Patnaik, “An accurate model for dynamic crosstalk analysis of CMOS gate driven on-chip interconnects using FDTD method,” Microelectron. J., vol. 45, no. 4, pp. 441–448, 2014. doi: 10.1016/j.mejo.2014.02.004
   Web of Science ®Google Scholar
• V. Ramesh Kumar, A. Alam, B. K. Kaushik, and A. Patnaik, “An unconditionally stable FDTD model for crosstalk analysis of VLSI interconnects,” IEEE Trans. Compon. Packag. Manuf. Technol., vol. 5, no. 12, pp. 1810–1817, 2015. doi: 10.1109/TCPMT.2015.2494519
   Web of Science ®Google Scholar
• V. R. Kumar, B. K. Kaushik, and A. Patnaik, “An accurate FDTD model for crosstalk analysis of CMOS-gate-driven coupled RLC interconnects,” IEEE Trans. Electromagn. Compat., vol. 56, no. 5, pp. 1185–1193, 2014. doi: 10.1109/TEMC.2014.2305801
   Web of Science ®Google Scholar
• B. K. Kumar, V. R. Kumar, and A. Patnik, Crosstalk in Modern on-Chip Interconnect: A FDTD Approach. Singapore: Springer Brief in Applied Science and Technology, 2016.
   Google Scholar
• Y. Agrawal, G. Kumar, and R. Chandel, “Comprehensive model for high-speed current-mode signaling in next generation MWCNT bundle interconnect using FDTD technique,” IEEE Trans. Nanotechnol., vol. 15, no. 4, pp. 590–598, 2016. doi: 10.1109/TNANO.2016.2558475
   Web of Science ®Google Scholar
• Y. Agrawal, R. Chandel, and M. Girish Kumar, “A novel unified model for copper and MLGNR interconnects using voltage and current-mode signaling schemes,” IEEE Trans. Electromagn. Compat., vol. 59, no. 1, pp. 217–227, 2017. doi: 10.1109/TEMC.2016.2587821
   Web of Science ®Google Scholar
• D. J. Comer and D. T. Comer, “Operating of analog MOS circuits in the weak moderate inversion,” IEEE Trans. Educ., vol. 47, no. 4, pp. 430–435, 2004. doi: 10.1109/TE.2004.825537
   Web of Science ®Google Scholar
• P. R. Gray, P. J. Hurst, S. H. Lewis, and R. G. Meyer, Analysis and Design of Analog Integrated Circuits, 4th ed. New York: Wiley, pp. 66–67, 2001.
   Google Scholar
• Kane S. Yee, “Numerical solution of initial boundary value problem involving Maxwell’s equations in isotropic media,” IEEE Trans. Antenna Propag., vol. 14, no. 3, pp. 302–307, May 1966. doi: 10.1109/TAP.1966.1138693
   Google Scholar
• Y. Agrawal and R. Chandel, “Crosstalk analysis of current-modes signaling coupled RLC interconnects using FDTD technique,” IETE Techn. Rev., vol. 33, no. 2, pp. 148–159, 2016. doi: 10.1080/02564602.2015.1056258
   Web of Science ®Google Scholar
• Y. Agrawal, M. Girish, and R. Chandel, “A unified delay, power and crosstalk model for current mode signaling multiwall carbon nanotube interconnects,” Springer Circ Syst Signal Process, vol. 37, no. 4, pp. 1359–1382, 2018. doi: 10.1007/s00034-017-0614-6
   Web of Science ®Google Scholar
• Semiconductor Industry Association, International Technology Roadmap for Semiconductors (ITRS).
   Google Scholar