REFERENCES
- Jiang , L. , Mikkelsen , J. , Koo , J. , Huber , D. , Yao , S. , Zhang , L. , Zhou , P. , Maveety , J. G. , Prasher , R. , Santiago , J. G. , Kenny , T. W. and Goodson , K. E. 2002 . Closed-Loop Electroosmotic Microchannel Cooling System for VLSI Circuits . IEEE Trans. Compon. Packag. Technol. , vol. 25 : 347 – 355 .
- Paris , D. A. , Birur , C. G. and Green , A. A. 2002 . Development of MEMS Microchannel Heat Sinks for Micro/Nano Spacecraft Thermal Control . Proceedings of the International Mechanical Engineering Congress and Exposition (IMECE) . November 17–22 2002 , New Orleans , LA . Paper no. IMECE2002–34293
- Stephan , P. C. and Busse , C. A. 1992 . Analysis of the Heat Transfer Coefficient of Grooved Heat Pipe Evaporator Walls . Int. J. Heat Mass Transfer , vol. 35 : 383 – 391 .
- Xu , X. and Carey , V. P. 1990 . Film Evaporation from Micro-Grooved Surface—An Approximate Heat Transfer Model and Its Comparison with Experimental Data . J. Thermophys. , vol. 4 : 512 – 520 .
- Moore , G. R. Progress in Digital Integrated Electronics . Proceedings of the IEEE International Electron Devices Meeting . Washington , DC . December . pp. 11 – 15 .
- Bar-Cohen , A. Optimisation of Vertical Pin-Fin Heat Sinks in Natural Convective Heat Transfer . Proceedings of Eleventh IHTC, vol. 3 . Kyonju , Korea. August 23–28 . pp. 501 – 506 .
- Webb , R. 2005 . Next Generation Devices for Electronic Cooling with Heat Rejection to Air . ASME J. Heat Transfer , vol. 127 : 2 – 9 .
- Fabbri , M. , Jiang , S. and Dhir , V. 2005 . A Comparative Study of Cooling of High Power Density Electronics Using Sprays and Microjets . ASME J. Heat Transfer , vol. 127 : 38 – 48 .
- Kandlikar , S. and Grande , W. Evaluation of Single Phase Flow in Microchannels for High Flux Chip Cooling—Thermohydraulic Performance Enhancement and Fabrication Technology . Second International Conference on Microchannels and Minichannels . Rochester , NY . June 17–19 . pp. 67 – 76 . Paper no. ICMM2004-2321
- Hironori , K. , Hitoshi , S. and Takeshi , N. Tokyo 2005 . High Performance Liquid Cooling Module for Electronic Equipment Tokyo , Hitachi Cable Review Report No. 24
- Mikkelsen , L. , Koo , J. J. M. , Huber , D. , Yao , S. , Zhang , L. , Zhou , P. , Maveety , J. G. , Prasher , R. , Santiago , J. G. , Kenny , T. W. and Goodson , K. E. 2002 . Closed-Loop Electroosmotic Microchannel Cooling System for VLSI Circuits . IEEE Trans. Compon. Packag. Technol. , vol. 25 : 347 – 355 .
- Fei , Y. T. 2005 . Error Theory and Data Processing , Beijing : China Machine Press . chap. 3
- Ohe , S. 1989 . Vapor-Liquid Equilibrium Data, Part II , Tokyo : Kodansha Ltd. .
- Hu , X. G. , Yan , X. H. and Zhao , Y. H. 2005 . Application of Micro Capillary Groove Evaporator to Electronic Chip Cooling . J. Chem. Ind. Eng. , vol. 56 : 413 – 416 .
- Hu , X. G. , Zhao , Y. H. and Yan , X. H. 2004 . A Novel Micro Cooling System for Electronic Devices Using a Micro Capillary Groove Evaporator . J. Enhanced Heat Transfer , vol. 11 : 407 – 415 .