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Original Articles

Monte Carlo Simulation of Thin Film Growth with Defect Formation: Application to Via Filling

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Pages 895-899 | Received 01 Jan 2004, Accepted 01 Feb 2004, Published online: 17 Jul 2006

References

References

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  • Kaneko Y Hiwatari Y Ohara K Murakami T 2002 Kinetic Monte Carlo simulation of thin film growth with void formation—Application to via filling— Technical Proceedings of the fifth International Conference on Modeling and Simulation of Microsystems 430
  • Kaneko , Y and Hiwatari , Y . 2002 . The solid-by-solid model for crystal growth and electroplating: kinetic Monte Carlo simulation . Recent Research Developments in Physics and Chemistry of Solids, Transworld Research Network , 1 : 48
  • Moffat , TP , Bonevich , JE , Huber , WH , Stanishevsky , A , Kelly , DR , Stafford , GR and Josell , D . 2000 . Superconformal electro deposition of copper in 500–900 nm features . J. Electrochem. Soc. , 147 : 4524
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