References
- Andricacos , P.C. , Uzoh , C. , Dukovic , J.O. , Horkans , J. and Deligianni , H. 1998 . Damascene copper electroplating for chip interconnections . IBM J. Res. Dev. , 42 : 567
- Moffat , T.P. , Bonevich , J.E. , Huber , W.H. , Stanishevsky , A. , Kelly , D.R. , Stafford , G.R. and Josell , D. 2000 . Superconformal electrodeposition of copper in 500–900 nm features . J. Electrochem. Soc. , 147 : 4524
- Taephaisitphongse , P. , Cao , Y. and West , A.C. 2001 . Electrtochemical and fill studies of a multicomponent additive package for copper deposition . J. Electrochem. Soc. , 148 : C492
- Cao , Y. , Taephaisitphongse , P. , Chalupa , R. and West , A.C. 2001 . Three-additive model of superfilling of copper . J. Electrochem. Soc. , 148 : C466
- Moffat , T.P. , Wheeler , D. and Josell , D. 2004 . Electrodeposition of copper in the SPS-PEG-CL additive system, I. Kinetic measurements: influence of SPS . J. Electrochem. Soc. , 151 : C262
- Hasegawa , M. , Negishi , Y. , Nakanishi , T. and Osaka , T. 2005 . Effects of additives on copper electrodeposition in submicrometer trenches . J. Electrochem. Soc. , 152 : C221
- Miura , S. , Oyamada , K. , Takada , Y. and Honma , H. 2001 . ULSI wiring formation by copper electroplating in the presence of additives . Electrochem. Soc. Jpn. , 69 : 773
- Akolkar , R. and Landau , U. 2004 . A time-dependent transport-kinetics model for additive interactions in copper interconnects metallization . J. Electrochem. Soc. , 151 : C702
- Gilmer , G.H. and Bennema , P. 1972 . Simulation of crystal growth with surface diffusion . J. Appl. Phys. , 43 : 1347
- Kaneko , Y. , Hiwatari , Y. , Ohara , K. and Murakami , T. 2000 . Monte Carlo simulation of thin film growth with lattice defects . J. Phys. Soc. Jpn. , 69 : 3607
- Kaneko , Y. , Hiwatari , Y. , Ohara , K. and Murakami , T. 2003 . “ Computer simulation of thin film growth and defect formation ” . In Surface and Coating Technology 215 Elsevier,
- Kaneko , Y. and Hiwatari , Y. 2002 . “ The solid-by-solid model for crystal growth and electroplating: Kinetic Monte Carlo simulation ” . In Recent Research Developments in Physics & Chemistry of Solids Vol. 1 , 48 (Transworld Research Network)
- Kaneko , Y. , Hiwatari , Y. , Ohara , K. and Murakami , T. 2002 . “ Kinetic Monte Carlo simulation of thin film growth with void formation–application to via filling ” . In Technical Proceedings of the Fifth International Conference on Modeling and Simulation of Microsystems 430
- Kaneko , Y. , Hiwatari , Y. and Ohara , K. 2004 . Monte Carlo simulation of thin film growth with defect formation: application to via filling . Mol. Sim. , 30 : 895