References
- Ning C, Jin J, Yang K, et al. A novel electromagnetic bandgap power plane etched with multiring CSRRs for suppressing simultaneous switching noise. IEEE Trans Electromagn Compat. 2018;60:733–737. doi: 10.1109/TEMC.2017.2731783
- Kwon JH, Sim DU, Kwak SI, et al. Novel electromagnetic bandgap array structure on power distribution network for suppressing simultaneous switching noise and minimizing effects on high-speed signals. IEEE Trans Electromagn Compat. 2010;52:365–372. doi: 10.1109/TEMC.2010.2045894
- Oo ZZ, Liu EX, Wei XC. Analysis of SMT decoupling capacitor placement in electronic packages using hybrid modeling method. Proceedings of the IEEE International Symposium Integrated Circuits, Singapore, Singapore; 2009. p. 627–630.
- Zhu HR, Li JJ, Mao JF. Ultra-wideband suppression of SSN using localized topology with CSRRs and embedded capacitance in high speed circuits. IEEE Trans Microw Theory Techn. 2013;61:764–772. doi: 10.1109/TMTT.2012.2231695
- Wu CT, Shiue GH, Lin SM, et al. Composite effects of reflections and ground bounce for signal line through a split power plane. IEEE Trans Adv Packag. 2002;25:297–301. doi: 10.1109/TADVP.2002.803263
- Shi LF, Zhang G, Jin MM, et al. Novel subregional embedded electromagnetic bandgap structure for SSN suppression. IEEE Trans Compon. Packag Manuf Technol. 2016;6:613–621. doi: 10.1109/TCPMT.2016.2531084
- Shi Y, Tang W, Liu S, et al. Mode analysis of miniaturized and stopband-enhanced composite electromagnetic bandgap structure for power/ground noise suppression. IEEE Trans Electromagn Compat. 2015;57:532–537. doi: 10.1109/TEMC.2014.2387949
- Kim M, Koo K, Shim Y, et al. Vertical stepped impedance EBG (VSI-EBG) structure for wideband suppression of simultaneous switching noise in multilayer PCBs. IEEE Trans Electromagn Compat. 2013;55:307–314. doi: 10.1109/TEMC.2012.2216883
- Martinez B, Ederra I, Gonzalo R, et al. Manufacturing tolerance analysis, fabrication, and characterization of 3-D submillimeter-wave electromagnetic-bandgap crystals. IEEE Trans Microw Theory Techn. 2007;55:672–681. doi: 10.1109/TMTT.2007.892803
- Bhuvaneswari B, Malathi K, Shrivastav AK. Effect of placing mushroom electromagnetic bandgap structures at the inset feedline of microstrip patches. IET Microw. Antennas Propag. 2012;6:1487–1497. doi: 10.1049/iet-map.2011.0237
- Rajo-Iglesias E, Inclan-Sanchez L, Vazquez-Roy JL, et al. Size reduction of mushroom-type EBG surfaces by using edge-located vias. IEEE Microw Wireless Compon Lett. 2007;17:670–672. doi: 10.1109/LMWC.2007.903456
- Wang XH, Wang BZ, Bi YH, et al. A novel uniplanar compact photonic bandgap power plane with ultra-broadband suppression of ground bounce noise. IEEE Microw Wireless Compon Lett. 2006;16:267–268. doi: 10.1109/LMWC.2006.873509
- Yang FR, Ma KP, Qian Y, et al. A uniplanar compact photonic bandgap (UC-PBG) structure and its applications for microwave circuit. IEEE Trans Microw Theory Techn. 1999;47:1509–1514. doi: 10.1109/22.780402
- Wu TL, Wang CC, Lin YH, et al. A novel power plane with super-wideband elimination of ground bounce noise on high speed circuits. IEEE Microw Wireless Compon Lett. 2005;15:174–176. doi: 10.1109/LMWC.2005.844216
- Joo SH, Kim DY, Lee HY. A s-bridged inductive electromagnetic bandgap power plane for suppression of ground bounce noise. IEEE Microw Wireless Compon Lett. 2007;17:709–711. doi: 10.1109/LMWC.2007.905604
- Kurra L, Abegaonkar MP, Basu A, et al. Switchable and tunable notch in ultra-wideband filter using electromagnetic bandgap structure. IEEE Microw Wireless Compon Lett. 2014;24:839–841. doi: 10.1109/LMWC.2014.2363020
- Ru Y, Chen P, Lan XK, Jin F. A novel planar electromagnetic bandgap structure with hybrid bridges for simultaneous switching noise suppression. IEEE 9th Conference Industry Electronic Application, Hangzhou, China; 2014. p. 536–539.
- Shi LF, Zhou DL. Selectively embedded electromagnetic bandgap structure for suppression of simultaneous switching noise. IEEE Trans Electromagn Compat. 2014;56:1370–1376. doi: 10.1109/TEMC.2014.2323980
- Jia Y, Zhang D, Zhang B. Slit-surface disturbance lattice EBG structure for simultaneously switching noise suppression in high-speed data acquisition system. IEEE Trans Compon Packag Manuf Technol. 2015; 5:86–98.
- Yan ZW, Xiong Y, Yu WL, et al. An improved miniaturized three-layer embedded electromagnetic bandgap structure. IEEE Trans Antennas Propag. 2014;62:2832–2837. doi: 10.1109/TAP.2014.2307311
- Rao PH. Multi-slit electromagnetic bandgap power plane for wideband noise suppression. IEEE Trans Compon. Packag Manuf Technol. 2011;1:1421–1427. doi: 10.1109/TCPMT.2011.2144978
- Kim KH, Schutt-Aine JE. Analysis and modeling of hybrid planar-type electromagnetic-bandgap structures and feasibility study on power distribution network applications. IEEE Trans Microw Theory Techn. 2008;56:178–186. doi: 10.1109/TMTT.2007.912199
- Choi J. Ultimate noise isolation in high-speed digital systems on packages and printed circuit boards. Electron Lett. 2013;49:594–595. doi: 10.1049/el.2012.4303