https://orcid.org/0000-0001-9148-989X
References
- Barker RJ, Luhmann NC, Booske JH, et al. Modern microwave and millimeter-wave power electronics. In: Barker RJ, Luhmann NC, Booske JH, et al., editors, Modern microwave and millimeter-wave power electronics. Hoboken, NJ: Wiley-VCH; April 2005. p. 872.
- Chua C, Tsai JM, Aditya S, et al. Microfabrication and characterization of W-band planar helix slow-wave structure with straight-edge connections. IEEE Trans Electron Devices. 2011;58(11):4098–4105. doi: 10.1109/TED.2011.2165284
- Kotiranta M, Krozer V, Zhurbenko V. Square helix TWT for THz frequencies. 2010 35th international conference on Infrared Millimeter and Terahertz Waves (IRMMW-THz), Rome, Italy; Piscataway, NJ: IEEE; 2010, p. 1–2.
- Chua CS, Zhao C, Aditya S. Design and fabrication of a planar helix slow-wave structure for C/X-band TWT. IEEE Trans Compon Packag Manuf Tech. 2017;10:1663–1669. doi: 10.1109/TCPMT.2017.2692303
- Babaeihaselghobi A, Akram MN, Ghavifekr HB, et al. Design and implementation of a planar helix for traveling wave tubes based on package compatible ball grid array technology. Microsyst Technol. 2020;26:1681–1687. doi: 10.1007/s00542-019-04713-8
- Qin HB, Zhang XP, Zhou MB, et al. Geometry effect on mechanical performance and fracture behavior of micro-scale ball grid array structure cu/sn–3.0 ag–0.5 cu/cu solder joints. Microelectron Reliab. 2015;55(8):1214–1225. doi: 10.1016/j.microrel.2015.05.013
- Lu D, Wong CP. Materials for advanced packaging. Vol. 181. New York: Springer; 2009.
- Cheng S, Huang C-M, Pecht M. A review of lead-free solders for electronics applications. Microelectron Reliab. 2017;75:77–95. doi: 10.1016/j.microrel.2017.06.016
- Sun L, Zhang L. Properties and microstructures of sn-ag-cu-x lead-free solder joints in electronic packaging. Adv Mater Sci Eng. 2015;2015:1–16.
- Lee LM, Mohamad AA. Interfacial reaction of sn-ag-cu lead-free solder alloy on cu: a review. Adv Mater Sci Eng. 2013;2013:1–11.
- Zeng G, McDonald S, Nogita K. Development of high-temperature solders. Microelectron Reliab. 2012;52(7):1306–1322. doi: 10.1016/j.microrel.2012.02.018
- Coonrod J. Selecting pcb materials for high-frequency applications. Microw Eng Eur. 2012;18–21.
- Sharma RK, Grede A, Chaudhary S, et al. Design of folded waveguide slow-wave structure for W-band TWT. IEEE Trans Plasma Sci. 2014;42(10):3430–3436. doi: 10.1109/TPS.2014.2352267