References
- J. Beretta: Power Electronics and Automobile – from State of the Art to Future Trends; EPE Journal, Vol. 8 – No. 3/4, September 1999
- F. Vareilhias: Smartmos in 42V Automotive System; EPE Conference, Graz, 2001
- Stress Test Qualification for Discrete Semiconductors – AEC – Q101; Automotive Electronics Council – Component Technical Committee, Rev. B, 2000
- N. Schofield, H. T. Yap, J. van Mierlo, G. Maggetto, P. van den Bossche: A State-of-the-Art Review and Database of Fuel Cells and their Application in Electric Vehicles useful for Education Needs; 10th European Conference for Power Electronics and Applications, Toulouse, 2003
- W. Leonhard: Feeding the Grid from Regenerative Sources, the Way to a Sustainable Energy Supply? EPE Journal, Vol. 12 – No. 3, August 2002
- H. Solmecke: Optimierte Stromrichter für Brennstoffzellenanlagen; Dissertation, Fernuniversität Hagen (Westfalen), 1998
- I. Graf: Power Semiconductor Modules for Automotive – DCB Substrate Technology for Increased Power; Power Systems Design Europe, Vol. 1 – Issue 6, July/August 2004
- W. Tursky, U. Scheuermann: Modulintegration – Herausforderungund Chance; VDE/ETG-Fachtagung Bauelemente der Leistungselektronik und ihre Anwendungen, Bad Nauheim, 2002
- R. Lappe, H. Conrad, M. Kronberg: Leistungselektronik; Verlag Technik, Berlin, 1987
- S. T. Peake, R. Grover, R. Farr, C. Rogers, G. Petkos: Fully Self-Aligned Power Trench-MOSFET utilizing Lum Pitch and 0,2 mm Trench Width; 14th international symposium on power semiconductor devices and ICs, 2002
- A. Neidig: Neue Montagetechnik für Leistungsmodule; Mikroelektronik, Vol. 5, Issue 2, Fachbeilage Mikroperipherik, 1991
- M. Arnold, R. Locher: The Revolution in Discrete Isolation Technique; PCIM Europe, Issue 3/1999
- A. Lindemann: Combining the Features of Modules and Discretes in a New Power Semiconductor Package; PCIM conference, Nürnberg, 2000
- A. Lindemann, P. Friedrichs, R. Rupp: New Semiconductor Material Power Components for High End Power Supplies; PCIM Conference, Nürnberg, 2002
- Wuchen Wu, Guo Gao, Limin Dong, Zhengyuan Wang, M. Held, P. Jacob, P. Scacco: Thermal Reliability of Power Insulated Gate Bipolar Transistor (IGBT) Modules; Twelfth Annual IEEE Semiconductor Thermal Measurement and Management Symposium, Austin (TX/USA) 1996
- A. Lindemann: A New High Current Dual Inline Packaged Trench MOSFET Three Phase Bridge as Contribution to Automotive System Integration; PCIM Conference, Nürnberg, 2003
- EC60747 part 15: Isolated Power Devices; International Electrotechnical Commission, Geneva, 1st Edition
- R. Amro, J. Lutz, A. Lindemann: Power Cycling with High Temperature Swing of Discrete Components based on different Technologies; 35th IEEE PESC and 3rd VDE/ETG CIPS conference, Aachen 2004
- S. Klaka: Eine Niedertemperatur-Verbindungstechnik zum Aufbau von Leistungshalb-leitermodulen; Cuvillier 1997
- A. Lindemann, G. Strauch: Properties of Direct Aluminium Bonded Substrates for Power Semiconductor Components; 35th IEEE PESC and 3rd VDE/ETG CIPS conference, Aachen 2004