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Journal of Modern Optics Volume 64, 2017 - Issue 20
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Articles

Neighbour-die effect on the measurement of wafer-level flip-chip LED dies in production lines

Tengfei ChenNational Engineering Research Center of Manufacturing Equipment Digitization, School of Mechanical Science and Engineering, Huazhong University of Science and Technology, Wuhan, China
,
Zirui WanNational Numerical Control System Engineering Research Center, School of Mechanical Science and Engineering, Huazhong University of Science and Technology, Wuhan, China
&
Bin LiNational Engineering Research Center of Manufacturing Equipment Digitization, School of Mechanical Science and Engineering, Huazhong University of Science and Technology, Wuhan, China;National Numerical Control System Engineering Research Center, School of Mechanical Science and Engineering, Huazhong University of Science and Technology, Wuhan, ChinaCorrespondence[email protected]
Pages 2141-2148 | Received 05 Apr 2017, Accepted 13 Jun 2017, Published online: 22 Jun 2017

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