Application of various micro-welding processes – characteristics and recent trends

References

• Aoyanagi , M. , Research and development of next generation electronic system mounting technology . Introduction of technology by SANSOKEN(National Institute of Advanced Industrial Science and Technology) , Available online at : http://unit.aist.go.jp/ .
   Google Scholar
• Haberland , J. , et al. , Super thin flip chip assemblies on flex substrates – Adhesive bonding and soldering technology – Reliability investigations and applications . Proc. of IMAPS 2006 International Symposium on Microelectronics , 148 – 155 .
   Google Scholar
• Infeon , Within 4 to 5 years, stop wire bonding packaging and move to flip-chip . http://www.sijapan.com/breaking/0502/16fcp_infeon050211. html .
   Google Scholar
• Iwasaki , T. , et al. , Development of chip-on-chip package with the use of ultrasonic flip-chip bonding . Journal of Electronic Information Communications Society , 2004 , 103 ( 648 ), 11 – 16 .
   Google Scholar
• Johnson , R.W. , et al. , The changing automotive environment: Hightemperature electronics . IEEE Transaction on electronics packaging manufacturing , 2004 , 27 ( 3 ), 164 – 176 .
   Google Scholar
• Matsuyama , K. 2001 . Welding techniques for mini to micro-components . Welding Technology , 49 ( 9 ) : 64 – 69 .
   Google Scholar
• Miyata , T. 2006 . Realisation of high-function ultra-small and thin photoelectric sensor by flip-chip mounting technique . OMRON Technics , 46 ( 2 ) : 40 – 45 .
   Google Scholar
• Nakatsuka , Y. 2003 . Interface control technique for metallic polymer materials in electronic field . Journal of Japan Welding Society , 72 ( 3 ) : 11 – 16 .
   Google Scholar
• Nomoto , T. , et al. , Yosetsu Setsugo Binran . Maruzen 2003 , 508 .
   Google Scholar
• Salzer , T.E. , A low cost high-reliability hermetic packaging option . Proc. of IMAPS International Symposium on Microelectronics , 1217 – 1225 .
   Google Scholar
• Seiwa Manufacturing Co., Library , Fusing welding . http://www.seiwamfg. co.jp/data/fusing.html .
   Google Scholar
• Takemoto , T. 2006 . Present state of lead-free soldering techniques . Journal of Japan Welding Society , 75 ( 7 ) : 37 – 42 .
   Google Scholar
• Unitek Miyachi Co , Part design and process guidelines for pulse heated reflow soldering of flexible circuits to printed circuit boards . 1999 , Available on line at : http://www.unitekequipment.com/
   Google Scholar
• Urushizaki , M. 2004 . Welding of thin sheets and small components in electrical equipments . This is a paper presented at the National Conference of Japan Welding Society , 22 : 17 – 22 .
   Google Scholar