References
- http://www.analog.com/jp/index.html etc .
- http://www.tij.co.jp/jrd/dlp/docs/index.html
- http://www.chem-agilent.com/contents.php?id=50
- http://www.yamaha.co.jp/news/2007/07030901.html
- http://www.sitime.jp/
- Tanaka , N . 2005 . Si through hole electrode technology for connecting layer built chips at room temperature . Renesas Edge , 10 : 18 – 20 .
- Nguyen C.T.G , Micromechanical components for miniaturized low power communications , Proceedings of the 1999 IEEE MTT-S International Microwave symposium .
- et al. , Q-factor definition and evaluation for spiral inductors fabricated using wafer level CSP Technology , IEEE transactions, Microwave Theory Tech , vol 53 , No. 10 , pp 3178 – 3184 .
- Eun-Chul Park et al. , Fully integrated low phase-noise VCOs with on-chip MEMS inductors , IEEE transactions, Microwave Theory Tech , vol 51 , No. 1 , 289 – 296 .
- Edited by Owada K , Frontier of RF MEMS technology – Key technology in the wireless age , CMC Publication , ISBN4-88231-560-2 .
- Rebeiz G , RF MEMS theory, design and technology , Wiley Interscience ISBN 0-471-20169-3 .
- http://www.omron.co.jp/r_d/mm/mmr.html
- http://www.mew.co.jp/ac/tech/pimites/explan-tech/operation_relay_001/index.jsp
- Nakamura K et al. , Wafer level packaged RF MEMS SPDT switch with thermal driven bimorph cantilever , The Sixth International Workshop on Microelectronics Assembling and Packaging .
- http://www.teravicta.com/
- Young D.J et al. , A low-noise RF voltage controlled oscillator using on-chip high-Q three dimensional coil inductor and micro machined variable capacitor , Solid-State Sensors and Actuators Workshop , 1998 , 6 , pp 128 – 131 .
- Nguyen T et al. , Toward chip-scale atomic clocks , Digest of Technical Papers , ISSCC 2005 , Vol 1 , 84 – 85 .
- http://www.sitime.com/ http://www.discera.com/
- http://www.suss.com/presentations/asianseminars07/data/12TeraVicta-McKillop.pdf
- Ayon A.A et al. , Characterisation of silicon wafer bonding for power MEMS application , Sensors and Actuators A 103 2003 , 1 – 8 .
- Li H.Q et al. , A high frequency high flow rate piezoelectrically driven MEMS micropump , IEEE Solid State Sensors and Actuators Workshop 2000 .
- Harpster T.J , Field–assisted bonding of glass to Si-Au eutectic solder for packaging applications , IEEE MEMS-03 Kyoto 630 – 633 .
- Lee T.M.H et al. , An improved anodic bonding process using pulsed voltage technique , IEEE Journal of Micromechanical Systems vol. 9 , No. 4 , pp 469 – 473 .
- Suga T et al. , Microassembly System for Integration of MEMS using the Surface Activate Bonding Method , IEIC Transactions on Electronics , E80-C , No. 2 , pp 297 – 302 .
- Dragoi V et al. , Low temperature MEMS manufacturing process; plasma activated bonding , MRS Spring Meeting 2005 .
- Seok S et al. , Packaging methodology for RF device using a BCB membrane transfer technique , J. Micromech Microeng 16 pp 2384 – 2388 .
- Corning pylex 7740 etc .
- Schjolberg-Henriksen K et al. , Sodium contamination in integrated MEMS packaged by anodic bonding , IEEE MEMS-03 Kyoto 626 – 629 .