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Welding International Volume 25, 2011 - Issue 3
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Articles

Effects of post heat treatment on 5052Al and 6063 aluminium joints during pulsed electric current bonding

Minefumi Matsui Niigata University, Niigata, Japan
,
Katsuya Kondou Niigata College of Technology, Niigata, Japan
,
Kouji Wada SMC Co. Ltd., Bangkok, Thailand
&
Osamu Ohashi Niigata University, Niigata, Japan
Pages 159-165 | Received 10 Sep 2008, Published online: 13 Feb 2011

References

  • Kondo , Yuza , Wada and Ohashi . 2008 . Behaviour of filler powder during pulsed current bonding . Powders Powder Technol. , 55 ( 6 ) : 401 – 407 .
  • Kondo , Matsumoto , Wada and Ohashi . 2008 . Effects of boding condition factors during pulsed current bonding of 5052 aluminium and 6063 aluminium alloys . Light Metal Weld. , 46 ( 11 ) : 511 – 517 .
  • Ohashi and Sasabe . 1989 . The effects of alloy elements on the behaviour of oxide layer on dispersion bonds of aluminium alloys – studies of oxide layers on dispersion bonds (4) . Quart J JWS , 7 ( 4 ) : 449 – 455 .
  • Xie , G , Ohashi , O , Sato , T , Yamaguchi , N , Song , M , Mitsuishi , K and Furuya , K . 2004 . Effect of Mg on the sintering of Al–Mg alloy powders by pulse electric-current sintering process . Mater Trans , 45 ( 3 ) : 904 – 909 .
  • Ikeuchi , Otani and Matsuda . 1996 . The behaviour of oxides in bond interfaces of Al–Mg–Si 6063 alloys – studies of Al alloy dispersion bonds by transmission electron microscopy (1) . Quart J JWS , 14 : 122 – 128 .
  • Otani , Ikeuchi and Matsuda . 1996 . Formation phases in bond interfaces of aluminium alloys – studies of Al alloy dispersion bonds by transmission electron microscopy (2) . Quart J JWS , 14 : 382 – 388 .
  • Otani , Ikeuchi and Matsuda . 1996 . The effects of bonding temperature on the bond interface of 6063, 5005 and 7N01 alloys – studies of Al alloy dispersion bonds by transmission electron microscopy (3) . Quart J JWS , 14 : 389 – 397 .
  • Otani , Ikeuchi and Matsuda . 1996 . The phases formed at the bond interface of Al–Mg two-element alloy – studies of Al alloy dispersion bonds by transmission electron microscopy (4) . Quart J JWS , 14 : 551 – 562 .
  • Otani , Ikeuchi and Matsuda . 1996 . The phases formed at the bond interface of Al–Mg two-element alloy (X = Mg, Si, Mn, Zn, Cu) – studies of Al alloy dispersion bonds by transmission electron microscopy (5) . Quart J JWS , 14 : 352 – 358 .
  • Kondo , Kimura and Watanabe . 2001 . Sintering behaviour using the reduction phenomena of the Al2O3 layer by magnesium – a study of grain surface structure analysis and sintering phenomena of aluminium alloy powder grains . Quart J JWS , 19 : 377 – 382 .
  • Ikezawa , Hirohashi , Yamaguchi and Ohashi . 2005 . The development of magnesium-containing 3003 aluminium alloy for dispersion bonding . J Jpn Inst Metals , 69 ( 8 ) : 739 – 742 .
  • Ohashi and Kaeda . 1988 . HIP treatment of SUS304 stainless steel dispersion bonds . Quart J JWS , 6 : 493 – 499 .

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