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Articles

The aggressive influence of lead-free solders and the protection of soldering devices against damage

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Pages 622-625 | Published online: 12 Jul 2011

References

  • Drzeniek , H . 2005 . Einsatz bleifreier Lote in Lotmaschinen beschichtet durch termisch gespritzte Schutzchichten, 2. Kolloquium “Bleifreies Löten” , Düsseldorf : DVS Verlag Düsseldorf .
  • Drzeniek , H and Mirski , Z . 2006 . Zwiększenie trwałości elementów lutowniczych stykających się z lutami bezołowiowymi, V Krajowa Konferencja Elektroniki , Darłowo : Wyd. Uczelniane Politechniki Koszalińskiej .
  • Lugscheider , E , Ernst , F and Janssen , H . 2003 . Thermisch gespritzte Schutzschichten für den Einsatz von bleifreier Loten in modernen Lötanlagen, 1. Kolloquium “Bleifreies Löten” , Wirges : DVS Verlag Düsseldorf .
  • Nowottnick , M , Pape , U , Wege , S and Lauer , T . 2003 . Die Lötbarkeit bleifreier Lotlegierungen (SnCu, SnAgCu) im Vergleich zu konventionellen Loten, 1. Kolloquium “Bleifreies Löten” , Wirges : DVS Verlag Düsseldorf .
  • Mirski Z, Drzeniek H. Copper solubilizing in dip soldering with lead-free solders and SnPb37 solder and protection of the elements of soldering facilities against damage, V Międzynarodowa Konferencja “Ekologia w elektronice”. 26–27 maja, Warszawa; 2008
  • Euromat Sp. z o. o. Katalog materiałów dodatkowych do natrysku cieplnego. Wrocław; 2008

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